Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
Electronics Forum | Wed Aug 11 18:35:17 EDT 2010 | julie1
Anyone work with or have knowledge about metal core/clad boards? The board I'm working with is approximately 2" X 3/4" aluminum core pcb, in a 56 up array. There are 3 LED placements per board. I'm having trouble getting a consistent screen print.
Electronics Forum | Wed Oct 30 01:23:19 EST 2002 | jasper
Normally warp max 1% of diagonal board measurement is acceptable. What's your p&p like? Some will not experience problems at all! reg Jasper
Used SMT Equipment | SPI / Solder Paste Inspection
The Best Value 3D SPI Solution ·Advanced 3D Measurement Accuracy and Inspection Reliability -Solves shadow problems by utilizing 2-way projection - Accurate inspection data with real-time PCB warp compensation -Minimize Cost and Maximi
Used SMT Equipment | SPI / Solder Paste Inspection
KY8030-2 The industry's Most Popular True 3D Solder Paste Inspection Solution . Best-in-dass measurement accuracy and inspection reliability -Solves shadow problems by utilizing 2-way projection - Accurate inspection data with real-time P
Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
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Parts & Supplies | Air / Vaccuum
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Technical Library | 2024-10-26 06:26:24.0
Copper pour is an essential design element in printed circuit boards (PCBs) that enhances thermal management, signal integrity, and electrical grounding. It involves filling unused areas on the board with copper, connecting them to power or ground planes. This feature helps manage heat dissipation, minimizes electromagnetic interference (EMI), and provides stable electrical grounding for complex circuits. While copper pour offers significant benefits, improper implementation may lead to manufacturing challenges like warping or soldering difficulties. This article explores the advantages of copper pour, the potential challenges, and how PCB Power integrates this design feature to optimize performance and durability. With advanced manufacturing processes, PCB Power ensures seamless copper pour integration for prototypes and large-scale production, offering turnkey PCB solutions for various industries.
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor?con=t&page=2
component cracking and warping. This is made possible by Dage’s 4th generation x-ray tube and image chain allowing features as small as 100nm to be resolved
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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