Industry Directory | Distributor / Manufacturer / Manufacturer's Representative / Standards Setting / Certification / Training Provider
PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
Industry Directory | Manufacturer's Representative
Manufacturers Representatives for SMT Equipment and Materials serving Southern California and Baja, MX
Lead Free SMT Reflow Oven XMR-1000D Product features: ▶fully meet all kinds of lead-free welding process requirements. ▶WindowsXP operating system, English and Chinese interface, easy to learn operation; Standard air furnace, patented hot air system
Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c
Electronics Forum | Wed Jul 16 11:54:25 EDT 2003 | MA/NY DDave
Hi, I agree with everyone else talk to the Mfg and ask for their recommended profiles. They should know the heating and the cooling profiles. If you really want to do this yourself you are going to have to run several experiments to determine just
Electronics Forum | Tue Jan 23 17:16:07 EST 2007 | darby
Check out the web sites of the major solder manufacturers. From a quick glance most of the pastes around that temperature range have problems with Zn content and may not be available as pastes???? Depending on your application, some of the lower melt
Used SMT Equipment | Soldering Equipment/Fluxes
Features: Windows XP operation software with Chinese and English alternative available. whole system under integration control can analyze and display the failure. All production data can be saved completely and analyzed. PC& Siemens PLC cont
Used SMT Equipment | Soldering - Reflow
SMTmax reflow oven family of high-throughput thermal processing system is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. SMTmax F6 systems provide optimized lead-f
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Technical Library | 2021-08-25 16:34:37.0
As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost completely transitioned to the lead-free solder alloys. The conventional SAC305 solder alloy used in lead-free electronic assembly has a high melting and processing temperature with a typical peak reflow temperature of 245ºC which is almost 30ºC higher than traditional eutectic SnPb reflow profile. Some of the drawbacks of this high melting and processing temperatures are yield loss due to component warpage which has an impact on solder joint formation like bridging, open defects, head on pillow.
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
ETA W2 Wave Soldering Equipment If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. wave soldering, wave soldering machine, DIP soldering, select
ETA W3 Lead-free Wave Soldering Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. wave soldering, wave soldering machine, DIP soldering
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | Delhi, India | Engineering,Production,Quality Control
Programming, Operation, Maintenance,Troubleshooting of SMT machines. Programming of cyber optics/saki(AOI) Programmingn of pcb seperater Temperature profiling (Making & Soldering) Testing,Troubleshooting of microcontroller based PCAs
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 97, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
beyond worklife Ambient humidity and temperature beyond solder paste work envelope Reflow-related causes of solder ball defects: Too rapid heating, particularly in preheat resulting in splattering. Keep below 4K/sec. per any 20 sec
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. See Nordson EFD printing paste products. Q R Reflow A term used to describe the heating and melting of solder alloy that allows it to flow as liquid again. Reflow Profile A graph of temperature over time experienced by a product during a reflow
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