Electronics Forum | Wed Aug 04 14:32:02 EDT 1999 | Barney Whalen
| Hi all, | | What is the typical placement head pressure for the GSM1 for placing the micro / chip Scale BGAs ? | | Thanks | Upinder | ======= | Hello Upinder, The typical placement pressure for a GSM1 with Flex head is 150-170 grams. You can p
Electronics Forum | Mon Mar 31 01:20:42 EST 2003 | Bryan Sheh
I agree that we should bake the pcb at higher temp and for longer time.for example...95--115c for at least 4 hours. also,keep the temp from 150--170c ,60-90 seconds while preheating. completely keep the moisture and volitales out of pcb and solder pa
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/qy202102180001-pinzas-plato-170-cutters-217279?page=160
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ORION Industries | http://orionindustries.com/pdfs/mylarel21.pdf
, % g/cm3 kV (Min.) 188 (750) 19/21 (27/30) 140/115 1.6/0.9 38 1.3928 17.5 225 (900) 19/20 (27/29) 150/130 1.6/1.1 41 1.3920 18.4 250 (1,000) 19/20 (27/29) 150/140 1.5/1.1 42 1.3925 19.0 350 (1,400) 18/17 (26/25) 170/170 1.3/0.8 46 1.3925 20.0 *MD = Machine Direction, TD
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