Carrier and PCB Cooling Buffer for over 40 Products
Electronics Manufacturing Service Company that specializes in Integrity, Trust and Commitment to our customers success. Our capabilities in the latest SMT and Enclosure manufacturing, coupled with our design and marketing experience, makes us a comp
Electronics Forum | Fri Sep 07 16:26:34 EDT 2018 | m_imtiaz
thanks for your input
Electronics Forum | Fri Mar 12 16:26:37 EST 1999 | Nancy
Is anyone familiar with any of Manncorp used in Surface Mount Assembly?
Used SMT Equipment | Soldering - Reflow
Heller 1707 Mark III Reflow Oven Equipment Description Heller Model Number: 1707MK-III Serial Number: 0815N3-B7A2S-301451-05 Year 8/2015 Edge Rail and Mesh Belt Temperature: 350C Lead Free 7 Zones Top and Bottom Windows XP O/S Power: 208-
Used SMT Equipment | Soldering - Reflow
Very Nice Electrovert Reflow Oven For Sale! See attached pictures and information below Equipment Description Electrovert Reflow Oven Model Number: Omni 5 Serial Number: 05-1111871-01 Year 2001 Left to Right PCB Flow 5 Heating Zones Top an
Industry News | 2016-07-26 16:26:28.0
We are a full-service, SMT asset management organization with the primary objective of providing great personal service to both buyers and sellers. We have many years of direct experience in the electronics manufacturing and assembly industries.
Industry News | 2019-12-21 16:26:09.0
The following statement can be attributed to John Mitchell, president and CEO of IPC, a global electronics industry association:
Parts & Supplies | SMT Equipment
Cleaning device support block of DEK Printer
Parts & Supplies | SMT Equipment
YAMAHA YV100II 39 Nozzle Pls kindly contact with us at any time, if you are insterest more info about products. Website : www.ksunsmt.com Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323 What's app: 15629932323
Technical Library | 2024-06-07 16:16:26.0
A description of laser PCB Depaneling, the technology used and benefits.
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Career Center | San Jose, California USA | Management
Company: Ma Labs Job Title: Manufacturing Manager Headquartered in San Jose, as leading PC component distributor and DRAM & Flash products manufacturer worldwide, Ma Labs has specialized in memory modules since 1985. We provide a full range of memor
Career Center | Corpus Christi, Texas USA | Engineering,Production,Quality Control,Technical Support
Provides supervison of all Lab & Hi-rel Screening personnel along with Calibration and the Electronic Tech covering this area. Oversees all test procedures and documentation relative to testing. Works with customers and engineers as required. POSIT
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