New SMT Equipment: 186 activation corrosion (7)

Soldering Assembly Services

Soldering Assembly Services

New Equipment | Assembly Services

S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillar

S-Bond Technologies

Kapp Copper-Bond Flux - High Temperature Soldering Flux

Kapp Copper-Bond Flux - High Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien

Kapp Alloy & Wire, Inc

Electronics Forum: 186 activation corrosion (41)

"R" type solder paste

Electronics Forum | Thu May 11 11:25:56 EDT 2017 | davef

Key to Rosin Fluxes [from SUPERIOR FLUX & MFG. CO.] Type R (Rosin): Non-activated rosin flux for soldering copper. Residues are non-corrosive and non-conductive. Type RMA (Rosin Mildly Activated): Mildly activated rosin flux that contains no chlori

Rework using flux pens

Electronics Forum | Tue Jan 08 17:29:20 EST 2002 | davef

Your research is on track. NC flux needs to reach activation temperature. Also, do not depend on the corrosion characteristics associated with the flux classification (ie, L1, L0, M1, M0, etc.), until the flux is activated by exposure to soldering

Used SMT Equipment: 186 activation corrosion (1)

Global Active Wave Soldering Machine GMS200

Global Active Wave Soldering Machine GMS200

Used SMT Equipment | Soldering - Wave

We are looking for overseas distributor / agent for our range of lead free wave soldering machines .The machine includes the following main features: Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted accordi

Xtreme Marketing LLP

Industry News: 186 activation corrosion (61)

Coretec, Inc. Reports 2002 Loss of $16.6M from Revenues of $69.5M

Industry News | 2003-03-06 08:29:50.0

Coretec experienced sequential growth in sales over the last four quarters and, while its yearly sales did decline, said its sales record still compares favorably

SMTnet

PCBA Cleaning Machine

Industry News | 2022-10-12 11:23:36.0

In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.

Dongguan Intercontinental Technology Co., Ltd.

Parts & Supplies: 186 activation corrosion (2)

Yamaha SMT Special Gripper Nozzle , Pick And Place Nozzle For Yamaha SMT Machine

Yamaha SMT Special Gripper Nozzle , Pick And Place Nozzle For Yamaha SMT Machine

Parts & Supplies | General Purpose Equipment

Special nozzle of LED for YAMAHA YS12 machine We can supply special nozzles for (Gripper nozzle )YAMAHA YG,YV,YX,YS machines , The nozzles for kind of SMD component , Just give me the nozzle size or component 1 KGR-M71N1-A0 NOZZLE 221F ASSY.

KingFei SMT Tech

Global Active Wave Soldering Machine GS350P

Global Active Wave Soldering Machine GS350P

Parts & Supplies | Soldering - Wave

Overseas Agent and Distributor Wanted ! Features : Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted according to PCB board width and moving speed to ensure even spraying all time. 2) Durable “Meiji

Xtreme Marketing LLP

Technical Library: 186 activation corrosion (3)

Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities

Technical Library | 2016-12-29 15:37:51.0

The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International

Kester

The Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations the Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations

Technical Library | 2020-11-24 23:01:04.0

The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.

Indium Corporation

Videos: 186 activation corrosion (6)

Electrovert Wave Soldering

Electrovert Wave Soldering

Videos

In the wave soldering industry, Electrovert® holds the industry reputation for having the most innovative technologies, best performance, highest reliability, and as being the best investment over a long product life cycle. Electrovert’s® Electra™, V

ITW EAE

The Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers.

The Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers.

Videos

DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl

ITW EAE

Events Calendar: 186 activation corrosion (2)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Ontario Webinar: Microvia Reliability - Understanding the Effects of Process, Design & Materials

Events Calendar | Tue May 30 00:00:00 EDT 2023 - Tue May 30 00:00:00 EDT 2023 | ,

Ontario Webinar: Microvia Reliability - Understanding the Effects of Process, Design & Materials

Surface Mount Technology Association (SMTA)

Career Center - Resumes: 186 activation corrosion (1)

Sr. Process & Quality Engineer

Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support

Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.

Express Newsletter: 186 activation corrosion (185)

Liquid Tin Corrosion and Lead Free Wave Soldering

Liquid Tin Corrosion and Lead Free Wave Soldering Liquid Tin Corrosion and Lead Free Wave Soldering Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant

Partner Websites: 186 activation corrosion (8)

Marine Manufacturing Machinery | Nordson

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/marine?con=t&page=36

Marine machinery must be able to withstand the rigors of weather, corrosion and intense wear and tear. Whether you need precision paint equipment to improve the efficiency of boat refurbishment and repair or adhesive dispensing and bondtesting equipment to ensure your materials are securely connected, we can help

ASYMTEK Products | Nordson Electronics Solutions

GPD Global FLOgems 1.1.0

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOwareGEMInterface_1.2.0.pdf

system initialization. It also refers to the value(s) that specified equipment variables are expected to contain at the end of system initialization. System Initialization The process that equipment performs at power-up, system activation, and/or system

GPD Global


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