170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Wed Feb 21 16:03:14 EST 2001 | blnorman
You're right, manufacturers time/temps will vary. A single manufacturer will have a host of materials with different cure schedules. We currently use 2 epoxies that cure in 2 - 3 minutes at 150�C. One will also cure in 5 minutes at 125�C. Talk t
Electronics Forum | Thu Feb 22 22:04:33 EST 2001 | davef
Travis: I just checked. You're correct. It's a SMD-310, circa 1985 with a 12" wide mesh belt and a screamin' three zones of solder meltin' fury.
Industry News | 2015-12-02 17:52:02.0
Nordson EFD introduces Unity™ HiTemp™ syringe barrels. These disposable 30cc barrels reduce the downtime and maintenance costs often associated with aluminum barrels commonly used in the pneumatic dispensing of hot melt adhesives.
Industry News | 2005-12-19 16:34:56.0
SCC-700 Quickly cools high temp applications with minimal floor space.
ETA High Reliability Special Reflow Oven ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special reflow ov
High-end Customized Reflow Soldering Oven ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special reflow o
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly
SMTnet Express, August 9, 2018, Subscribers: 31,244, Companies: 11,011, Users: 25,072 New Phosphorus-based Curing Agents for PWB A. Piotrowski, M. Zhang, S. Levchik - ICL-IP , Y. Zilberman, Eran Gluz - IMI As a result of the continuous
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/additional-product-sub-type/plural-component-systems?con=t&page=35
. ISC Bottom Cure System Industrial Coating Systems The ISC bottom cure system works with either solventborne or waterborne coatings to cure protective coatings applied to can bottoms. EcoDry®
