Semi-Automatic SMT Stencil Printers - P300, P350, P400. Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. Printing scraper can rotate 45 degrees fixed up, easy printing stencil a
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Used SMT Equipment | Pick and Place/Feeders
2000 Mydata MY19 SMT Pick & Place Note: This Lot Does Not Include any Feeders, Magazines or the Tex Tower. Item Location: Willoughby, OH USA Serial: 19107 Features: 21K HYDRA Linescan New Midas Unit OS: Linux Fedora S/W: TPSYS 2.6.5
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Industry News | 2003-03-31 09:31:11.0
Electronic contract manufacturers face tough realities
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Parts & Supplies | Pick and Place/Feeders
KHY-M66TE-003 feeder electric connector 1 KHJ-MC103-02 BLOCK,FRONT 1 2 KHJ-MC104-00 RAIL,UNDER 1 3 KHJ-MC105-00 PIN,TAIL 1 4 KHJ-MC10F-00 SCREW,FLAT HEAD 2 5 KHJ-MC10M-00 BOLT,HEX. S/H 2 6 KHJ-MC139-00 SHAFT,IDLE GEAR 1 1 7 KHJ-MC16J-00
Parts & Supplies | SMT Equipment
YAMAHA YV100XG KGA-M9174-10X KGA-M9172-00X Locate-pin Conveyor 1 KV7-M9171-01X PLATE 1-1. LOCATION 1 2 KV7-M9171-11X PLATE 1-2. LOCATION 1 3 KGA-M9172-00X HOLDER LOCATE PIN 2 4 KGA-M9174-00X PIN 1, LOCATION 1 4-1 1 Delete 2003/2/11 M320041 5
Technical Library | 2021-03-04 15:22:33.0
Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4- phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
Make: Universal Instruments Model: Advantis 4982C Vintage: 2006 PEC Camera Single Beam Advanits – Lead Screw FlexJet 7 Spindle Head with 2.6 mil Camera Condition: Complete & Operational Location & Shipping: Nashua, NH / FOB Origin A
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
Career Center | Lancaster, California USA | Purchasing
Purchasing • Customer Service • Material/Production Planning • MRP Analysis • Cost Control Supply Chain Management • Supply & Demand Strategies • Business Analysis • Strategic Planning • Business Forecasts • Organizational & Staff Development •Team
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. Künstliche Intelligenz gilt als Enabler für mehr Produktivität und bietet somit enorme Wachstumschancen: 2,6 Milliarden US-Dollar globales Marktvolumen für
