Industry Directory | Standards Setting / Certification / Training Provider / Consultant / Service Provider / Manufacturer
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Used SMT Equipment | Soldering - Reflow
13 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Dual Lane, Gen 5.2, OMS
Used SMT Equipment | In-Circuit Testers
2) Controller(s) B180L & RP5700 ** includes switch boxes and cables ** (2) ASRU C Cards (2) Control Xt Cards (18) Hybrid Double Density Pin Cards (2) 6624 Power Supplies (1) Printer Condition: Complete & Operational “Passes Diagnostics”
Industry News | 2019-09-12 22:51:52.0
Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Training Courses | | | IPC J-STD-001 Expert (CSE)
The IPC J-STD-001 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC J-STD-001 standard.
Events Calendar | Mon Apr 06 18:30:00 UTC 2020 - Mon Apr 06 18:30:00 UTC 2020 | ,
Harsh Environment Failure - Causes & Cures - FREE Pre-Conference Webinar
Events Calendar | Mon Apr 12 18:30:00 UTC 2021 - Mon Apr 12 18:30:00 UTC 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Garland, Texas USA | Production
We are currently seeking SMT Solderers for a manufacturing company in Garland. Applicants must have at least 1 yr of experience, and be able to pass a soldering test. Positions are part time and full time. Pay rate is $10-12 DOE. Please reply back
Career Center | Clarksburg, Laghman | Engineering
Immediate opportunities for SMT Solder Specialist. Also have these positions open. All immediate opportunities: Assembler: Must have strong electro mechanical manufacturing skills. Experience with assembly of electro mechanical products in a high
Career Center | north augusta, South Carolina USA | Production,Quality Control
I am a skilled smt operator that pays close attention to detail! With my experience in the electronic field for the passed 10 years proving to be an asset to all companies that i have worked for in providing quality work and ensuring on time delivery
Career Center | , India; Punjab India | Engineering,Management,Production
i am a diploma holder in electronics and tele-comm. engg. passed out in 2001. having an exp. of 6.5 yrs incuding 2yrs as Manager Production in ELectronics Manufacturing for further details check out my Resume.
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page Solder Paste Measurement: A Yield Improvement Strategy That Helps Improve Profits by Mike Riddle , ASC
to Front Page Solder Paste Measurement: A Yield Improvem
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/pcx-180-solder-paste-mixer-500g-2-225931?page=322&order=name+desc
SOLDER PASTE MIXER (500g*2) | Qinyi Electronics Co.,Ltd × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products SOLDER PASTE MIXER (500g*2
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/new-2016-solder-joint-goals_topic1921&OB=DESC_page2.html
New 2016 Solder Joint Goals - PCB Libraries Forum - Page 2 Forum Home > Libraries > PCB Library Construction Guidelines New Posts FAQ Search Events Register Login New 2016 Solder Joint Goals
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