Industry Directory | Manufacturer
Delivers PowerCAD CE full function mobile/wireless 2/3D CAD with support for the latest AutoCAD R2002 file formats and innovative VoiceNOTE technology. Works as full-powered independent mobile CAD system or portable extension for leading desktop CAD programs.
Industry Directory | Manufacturer
we are a professional PCB&PCBA manufacturer with top quality,quick turn and turnkey service.We have our own SMT production lines, professional customers service team,components procurement team and assembly& test team.
New Equipment | Board Handling - Conveyors
Model No: KSUN 460 Automatic loader PCB loading time: Approx 6 seconds Magazine change-over time: Approx 30 seconds Power supply: 100-230V AC (customized ), single phase, MAX 300V/A Air pressure: 4-6 bar, MAX 10L/minute Transport height: 900±20
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
Electronics Forum | Wed Jan 17 03:43:11 EST 2007 | aj
2-3mmm from edge of component
Electronics Forum | Tue Jul 19 10:23:55 EDT 2011 | rway
This won't help much. At most it may give him a 2-3 board buffer, then what?
Used SMT Equipment | Pick and Place/Feeders
Includes Parts Tray Feeder OS: Windows XP SW: 8.3.0.10 Cameras: Front ULC magellan firewire 1394 .94 mil per pixel. Rear ULC firewire 2.3 per pixel. Pecs: pec beam1 firewire 1394 .66 mil per pixel. pec beam 2 firewire 1394 .
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2003-05-12 09:19:51.0
No larger than conventional 12A wire-to-board connectors for PCB applications
Parts & Supplies | SMT Equipment
Belt&Pulley Part Name：SONY皮带 (2.3x1.1x1015mm) PART No：4-722-644-01 Part Name：SONY皮带 (2.3x1.1x640mm) PART No：4-722-644-21 Part Name：SONY皮带 (2.3x1.1x1870mm) PART No：4-720-921-11 Part Name：SONY皮带 (2.3x1.1x545mm) PART No：4-722-644-31 Pa
Parts & Supplies | SMT Equipment
Belt&Pulley Part Name：SONY (2.3x1.1x1015mm) PART No：4-722-644-01 Part Name：SONY (2.3x1.1x640mm) PART No：4-722-644-21 Part Name：SONY (2.3x1.1x1870mm) PART No：4-720-921-11 Part Name：SONY (2.3x1.1x545mm) PART No：4-722-644-31 Part Name：
Technical Library | 2017-10-19 01:17:56.0
Wetting balance testing has been an industry standard for evaluating the solderability of surface finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as a function of Time, along with the individual data outputs "Time to Zero" T(0), "Time to Two-Thirds Maximum Force" T(2/3), and "Maximum Force" F(max) are usually used to evaluate the solderability performance of various surface finishes. While a visual interpretation of the full curve is a quick way to compare various test results, this method is subjective and does not lend itself readily to a rigorous statistical evaluation. Therefore, very often, when a statistical evaluation is desired for comparing the solderability between different surface finishes or different test conditions, one of the individual parameters is chosen for convenience. However, focusing on a single output usually doesn't provide a complete picture of the solderability of the surface finish being evaluated.In this paper, various models here-in labeled as "point" and "area" models are generated using the three most commonly evaluated individual outputs T(0), T(2/3), and F(max). These models have been studied to quantify how well each describes the full wetting balance curve. The solderability score (S-Score) with ranking from 0 to 10 were given to quantify the wetting balance curve as the result of the model study, which corresponds well with experimental results.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
we have many universal gold plus feeders to sell . www.smt-store.com
Make: Universal Instruments Model: Genesis GX-11 Vintage: 2014 Details: Software Version 6.08 Head Assembly: Inline 4 Genesis 1M/P PEC Camera Removable Feeder Bank Assembly Magellen 2.3MPP Camera NPI Mode Left to Right Board Transport 3MM Cleara
Career Center | Irvine, California USA | Sales/Marketing
We are looking for a sales person to bring in new customers for our contract manufacturing company. We specialize in SMT and Thru-Hole assemblies. 2-3 years experience in CEM field.
Career Center | Asheville, North Carolina USA | Production
Person needs to have Quad QSP-2 schooling or 2-3years experience in operating and programing. Pay DOE
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Hands on experience in PLC based machine, DEK Printer Machine, Camlot Glue dot machine, Fuji NXT, SPI machine, reflow: Vitronics XPM2/3, Expertise in SMT Profiling Qualification & NPI Build, Soldering defects, Analysis & rework. Line modifi
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
