New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Electronics Forum | Tue Oct 13 12:32:43 EDT 2009 | davef
2.6.3 Test Pad Location Tolerances, third bullet. Why does Entek require different test point spacing than other surface finishes? Page 55, top image is off the page, partially. 2.3.6 Depanelization of Arrays, 10th bullet [Breakaway Scoring] refers
Electronics Forum | Wed Oct 16 13:16:11 EDT 2002 | davef
Hey Mar, Sounds serious!!! Poke around Buehler, Leco, or Struers Try IPC TM-650 Test Methods Manual: 2.3.6A Etching, Ammonium Persulfate Method - 7/75 2.3.7A Etching, Ferric Chloride Method - 7/75 2.3.7.1A Cupric Chloride Etching Method - 12/94
Parts & Supplies | SMT Equipment
Machine Parts No. IN OUT CP33LV SH/1608 0.5 1 CP33LV 2125 0.7/1.4 CP40L(V) N045 0.5 1 CP40L(V) N045 0.43 1 CP40L(V) N06 0.52 0.82 CP40L(V) N08 0.8 1.5 CP40L(V) N08 0.8 1.5 CP40L(V) N14
