Electronics Forum | Sat Aug 20 13:23:22 EDT 2011 | saju86ece
Hi, We are facing solder ball issue in Chip component of PCB. We had tried DEK parameter setting changes and also reflow setting but still now not yet solve this problem. board details are, 1.Class 2 prodct 2.HASL Finishing Plz advice me what actio
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Procured test board with bare copper pads protected with OSP. (Future testing to be run with HASL Lead Free Pads) ♦ Tested 2 pastes: ♦ 96.5% Sn/3.5% Ag with RMA flux melt point 221
