| http://etasmt.com/te_news_bulletin/2020-05-04/15961.chtml
. The role of the cooling zone is to let the temperature drop to solidify the solder joint, and the cooling rate will affect the strength of the solder joint
| https://www.eptac.com/category/upcoming-webinars/shown.bs.collapse/page/9/__/ais-highlight__/129.432%25/page/2/gtm.start/__/ais-highlight__/page/2/
containing lead with liquidus temperatures under 350°C (662 o F). Although these low melt alloys do not stress the physical components the shear and tensile strength characteristics of these low temperature alloys are typically not used or suitable for
