Industry Directory: 20 mil aperture (15)

Tropical Stencil

Industry Directory | Consultant / Service Provider / Manufacturer

Tropical Stencil is dedicated to providing the highest quality Laser Cut Stencils; with our rapid response, you will have your Stencil delivered on-time.

Procyon PCB, Inc.

Industry Directory | Manufacturer / Other

A small business that offers design engineers PCB prototypes with few restrictions. Our PCB's will be similar to the electrical characteristics and constraints that are being designed for and required in today's high speed and RF circuits. We offer up to 8 layers, hidden vias, over 20 choices of board thickness' and materials. Geometery as small as 4 mil lines & 4 mil spacing.

New SMT Equipment: 20 mil aperture (142)

Hand Soldering Training

Hand Soldering Training

New Equipment | Education/Training

The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo

Blackfox Training Institute, LLC

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

Electronics Forum: 20 mil aperture (1069)

20 mil qfp bridging

Electronics Forum | Thu Aug 12 18:43:49 EDT 1999 | Wayne S.

Hello Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening 100 durometer blade. Getting "tails" on deposits. Trie

Re: 20 mil qfp bridging

Electronics Forum | Thu Aug 12 22:38:44 EDT 1999 | Dave F

| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi

Used SMT Equipment: 20 mil aperture (85)

MPM Momemtum +

MPM Momemtum +

Used SMT Equipment | Screen Printers

Momentum is designed to provide efficiency and speed. With its triple track conveyor rails and servo drive motors, for example, the Momentum Elite model orders the highest performance capacity in the series, making it the ideal printer for high volum

SMTUNION

Orbotech Orbotech Symbion P-36

Orbotech Orbotech Symbion P-36

Used SMT Equipment | SPI / Solder Paste Inspection

2006 Orbotech Symbion P36 3D SPI. Nice machine! ◾Automatic Solder Paste Inspection ◾Max board size : 20 x 21 in. ◾Paste Height Range 50-300μm (0.2 – 12 mil) ◾Inspection speed : Up to 60 sq. cm/sec (9.3 sq. in/sec) ◾Height Accuracy / Repeatability 5 μ

smtXtra

Industry News: 20 mil aperture (222)

Deep Micro-vias Available on Large-format PCBs

Industry News | 2003-02-25 08:18:29.0

Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.

SMTnet

Co-solvent Process Saves Electronics Manufacturer �45,000 a Year

Industry News | 2003-06-05 08:11:23.0

Kerry co-solvent system pays for itself in 13 months

SMTnet

Parts & Supplies: 20 mil aperture (21)

Fuji NOZZLE NXT-H04-7.0G (AA07K00/AA07K04/AA07K05)

Fuji NOZZLE NXT-H04-7.0G (AA07K00/AA07K04/AA07K05)

Parts & Supplies | SMT Equipment

NOZZLE NXT-H04-7.0G (AA07K00/AA07K04/AA07K05) Spare Name: AA07K00 AA07K04 AA07K05 NXT-H04-7.0G Specification: H04 Placing Head Nozzle Dia, 7.0 w / rubber pad NXT H04 7.0G nozzle FUJI NXT H01 PICK UP NOZZLE ¢ Applicable models: FUJI NXT H

KingFei SMT Tech

Fuji NXT nozzle NXT-H01-7.0G (AA07300/AA07310)

Fuji NXT nozzle NXT-H01-7.0G (AA07300/AA07310)

Parts & Supplies | Pick and Place/Feeders

NXT nozzle NXT-H01-7.0G (AA07300/AA07310) Spare Name: AA07300 AA07310 NXT-H01-7.0G Specifications Model: NXT NOZZLE Head H01 Dia 7.0G. FUJI NXT H01 PICK UP NOZZLE ¢ Applicable models: FUJI NXT H01 AA0AS00 FUJI NXT H01 1.0 AA05800 F

KingFei SMT Tech

Technical Library: 20 mil aperture (6)

PCB Design Optimization of 0201 Packages for Assembly Processes

Technical Library | 2023-05-02 19:03:34.0

The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.

Flextronics International

Step Stencil design when 01005 and 0.3mm pitch uBGA's coexist with RF Shields

Technical Library | 2023-07-25 16:50:02.0

Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.

Photo Stencil LLC

Videos: 20 mil aperture (23)

MPM MOMENTUM+ PRINTER / M202388

Videos

Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema

Qinyi Electronics Co.,Ltd

MPM MOMENTUM+ PRINTER/M202395

Videos

Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema

Qinyi Electronics Co.,Ltd

Training Courses: 20 mil aperture (2)

ESD Control for Electronics Assembly

Training Courses | ONLINE | | ESD Control Training Courses

Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.

Association Connecting Electronics Industries (IPC)

Advanced SMT Rework Training Course

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Career Center - Jobs: 20 mil aperture (6)

Source Inspector

Career Center | Wylie, Texas USA | Engineering,Production,Quality Control

Candidate needed for source inspection to the requirements of Mil-P-55110 IPC 6011, class 1,2 and 3 IPC 6012, class 1,2 and 3, PWB-PWG, Exp. with PWA and soldering necessary.

Bureau Veritas

Engineer II/III - first shift

Career Center | , Florida USA | Human Resources

SMT contract manufacturing environment. Responsible for developing manufacturing processes to deliver consistently high product quality. Technical representative on Customer Satisfaction Team responsible for reviewing and implementing ECO�s, provid

MACK Technologies Florida, Inc.

Career Center - Resumes: 20 mil aperture (5)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

International Sales Management, Asian Regional G.M. / Vice President, Global Key Account, Business Devlopment, Product Marketing, Consulting, Service Management

Career Center | Fallbrook, California USA | Sales/Marketing

I have over 5 years of experience as the Asian Regional Vice President of Sales and Marketing for the Siemens SMT equipment division, over 7 years as the President of a small international Manufacturers Representative business selling SMT machines in

Express Newsletter: 20 mil aperture (472)

Partner Websites: 20 mil aperture (215)

JM-20 Sn63/Pb37 - 0.4 mm No Clean Leaded Flux Cored Solder Wire - PCBASupplies

| https://pcbasupplies.com/jm-20-sn63-pb37-0-4-mm-cored-leaded-solder-wire/

JM-20 Sn63/Pb37 - 0.4 mm No Clean Leaded Flux Cored Solder Wire - PCBASupplies Login Create Account Contact View My Cart Menu

Die Shear Test Equipment | Shear Testing | Nordson

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=20

the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883   Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to

ASYMTEK Products | Nordson Electronics Solutions


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Training online, at your facility, or at one of our worldwide training centers"
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World's Best Reflow Oven Customizable for Unique Applications
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Low-cost, self-paced, online training on electronics manufacturing fundamentals