Industry Directory | Other / Manufacturer
A small business that offers design engineers PCB prototypes with few restrictions. Our PCB's will be similar to the electrical characteristics and constraints that are being designed for and required in today's high speed and RF circuits. We offer up to 8 layers, hidden vias, over 20 choices of board thickness' and materials. Geometery as small as 4 mil lines & 4 mil spacing.
Industry Directory | Manufacturer
We are Wave Technology from India. We are Electronic Manufacturing Services provider, we do PCB assembling services for all the electronics product.
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
New Equipment | Board Handling - Pallets,Carriers,Fixtures
BEST Inc. design and fabricates magnetic fixtures for ioT, flex and rigid-flex applications. Made frommagnetized steel, these fixtures are designed and fabricated to hold flat flex circuits. They can be used for pick and place, coating, depanelizing
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV88XG SMT Machine Specification (Note: Multifunctional machine, two working heads, two nozzle heads) Placement speed 0.55s /CHIP(* best condition); 0.9s /QFP(□31mm, 0.5mm spacing)
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)substrate t
Industry News | 2010-07-10 08:36:16.0
Partners with MRC to bring high quality stencils quickly and with an accent on service
Industry News | 2010-07-10 08:39:05.0
BEST Partners with MRC to bring customers SMT Metal Stencils
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Wylie, Texas USA | Engineering,Production,Quality Control
Candidate needed for source inspection to the requirements of Mil-P-55110 IPC 6011, class 1,2 and 3 IPC 6012, class 1,2 and 3, PWB-PWG, Exp. with PWA and soldering necessary.
Career Center | Any location, USA | Engineering,Management,Quality Control
This Electronics Auditor position is an excellent opportunity for recent retirees or consultants that have experience with Printed Boards, Printed Board Assemblies, or Cable and Wire Harness Assemblies. To learn more about this opportunity click no
Career Center | Minneapolis, Minnesota USA | Engineering,Management,Quality Control,Research and Development
Advanced Process/Manufacturing Engineer with many years of experience at multiple companies. Unique ability to perform and establish root cause. Designer, developer, and implementer of a wide variety of automated assembly systems, special projects,
Career Center | Parkland, Alabama USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
Robert "Vince" Dafter, Jr. 1126 Rising Sun Ave. Parkland, Pa 19047 E-mail: dint46@verizon.net (215) 757 4806 (H) OBJECTIVE To secure a professional position in manufacturing or a service industry. Where my Quality/Engineering Management, supervision
| https://pcbasupplies.com/jm-20-sn63-pb37-0-4-mm-cored-leaded-solder-wire/
JM-20 Sn63/Pb37 - 0.4 mm No Clean Leaded Flux Cored Solder Wire - PCBASupplies Login Create Account Contact View My Cart Menu
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] Investigation Specifics: 84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs Sn63 solder paste Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes Thermal cycling: 0°C-100
