Industry Directory | Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
Industry Directory | Manufacturer's Representative
Printed Circuit Boards (unpopulated)
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
Effective Solutions for any Odd-Form Application on any OEM Platform. Count On Tools has the experience and manufacturing flexibility to be able to develop custom engineered solutions to satisfy your individual Process Requirements. With over 20 y
Electronics Forum | Fri Mar 22 17:14:15 EST 2002 | jseagle
What is the height, width, and length of the connector, packaging? We currently place a 2x20 2mm gull wing SMT connector measuring 8mm H x 38mm L x 6.1mm W, packaged on tape and reel with a plastic pickup in the center. We do this on an Assembleon
Electronics Forum | Fri May 26 14:03:52 EDT 2000 | GP
I have a problem on fine pitch SMT connector reflow. The board size is 18" x 12" with 8 layers FR4 material and emersion gold finishing. All the other components include 0603 on the board are reflow very well, except 20 mil pitch SMT connectors. The
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV88XG SMT Machine Specification (Note: Multifunctional machine, two working heads, two nozzle heads) Placement speed 0.55s /CHIP(* best condition); 0.9s /QFP(□31mm, 0.5mm spacing)
Used SMT Equipment | SMT Equipment
accuracy :CHIP :±0.08mm;IC :±0.04mm unit range:8mm-72mm Strip, bulk material, with tray Model :JUKI KE-2020 name:Universal placement equipment,With IC cabinet ,high accuracy ,stable,suitable for all kinds of unit components with 5 heads conditio
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Parts & Supplies | SMT Equipment
CYINDER CONNECTOR (107422) CYINDER CONNECTOR (107422) if need more info about SMT spare parts, pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksuns
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
http://www.gpd-global.com Conformal coating (SimpleCoat) demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system. The Spray Valve sprays HumiSeal 1B31 from a height of approximately 20 mm above the board. The Volumetr
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | , Florida USA | Human Resources
SMT contract manufacturing environment. Responsible for developing manufacturing processes to deliver consistently high product quality. Technical representative on Customer Satisfaction Team responsible for reviewing and implementing ECO�s, provid
Career Center | TULSA, Oklahoma USA | Engineering,Production
This opportunity is with a global industry leader designing and manufacturing sophisticated electronic components and devices. Our client company plays a very significant role throughout the world providing essential equipment and components to the m
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | Alleppey, Kerala India | Engineering,Production,Quality Control
Good knowledge about the operations of various PCB surface mounting machines Good communication skills
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
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1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_tyco_connector_press.html
– 600 lbs [182 kg] Price : CALL - 978-790-2774 Tyco Connector Press See More Photos Below Home SMT & PCB Equipment Industrial Equipment
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Original MPM SMT Screen Printer Parts Quick Fitting Pipe Connector Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
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