Industry Directory | Manufacturer / Other
ABM designs and manufactures mask aligners, exposure systems, photolithographic products and accessories used in the production of semiconductor integrated circuits.
Technical parameter: Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2
Electronics Forum | Mon Apr 15 22:37:27 EDT 2002 | davef
Regarding your customer suditor, it would have been nice if you said something like ... Routinely, our testing shall be less than 1.56 microgram/cm^2 NaCl equivalent ionic or ionizable flux residue, according to TM-650, Method 2.3.35 'Detection And
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | Flexible Mounters
Product Name: Samsung high speed SM411 chip mounter Product number: SM411 Detailed product introduction Samsung high speed SM411 chip mounter parameters type: SM411 On the way: In - flight vision Number: 6 - axis *2 axis platform mount speed:
Industry News | 2018-09-23 09:57:15.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Industry News | 2012-01-24 20:21:12.0
Count On Tools introduces the new ezLOAD PCB support system. With the recent increase of densely populated double-sided circuit boards, COT recognized the need for more affordable board support options in the electronics manufacturing industry. The end result is an innovative design that is not only easy to setup and install, but also offers industry-leading benefits to EMS companies and contract manufacturers worldwide.
Parts & Supplies | Tape and Reel
Panansonic SMT Splice tape CM402 CM2-08,CM2-12,CM2-16,CM2-24 Part Number Description Package CM1-08 SMT splice tape for 8mm Belts 500PCS/Box CM1-12 SMT splice tape for 12mm Belts 500PCS/Box CM1-16 SMT splice tape for 16mm Belts 500PCS/Box CM1
Parts & Supplies | Tape and Reel
Panansonic SMT Splice tape CM402 CM2-08,CM2-12,CM2-16,CM2-24 Part Number Description Package CM1-08 SMT splice tape for 8mm Belts 500PCS/Box CM1-12 SMT splice tape for 12mm Belts 500PCS/Box CM1-16 SMT splice tape for 16mm Belts 500PCS/Box CM1
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Right Transportation Speed 1500mm/s Feeding Mode Section type transportation guide rail Rail Width Adjustment Automatic Communication Signal SMEMA PCB Positioning Upper and lower guide rail
Offline Dual Table PCB Depaneling Router Machine with SycoTec Spindle 4025HY PCB Depaneling Router Features: 1. Two-slide PCB Separator 2. Low stress 3. Sharp cutting edge 4. Manul loading /unloading 5. High speed cutting by 4 axes control(XY
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Back to Top Questions or comments? Contact us © 1995-2002 SMTnet
KingFei SMT Tech | https://www.smtspare-parts.com/sale-40884743-bc-m-tn-smt-storage-machine-fully-automatic-storage-machine.html
Standard machines with * Specifications/Type *BC-M-TN BC-L-TN BC-LL-TN BC-XL-TN Supply Voltage AC220V/50/60HZ AC220V/50/60HZ AC220V/50/60HZ AC220V/50/60HZ Supply air pressure 5kgf/cm2 5kgf/cm2 5kgf/cm2 5kgf/cm2 PCB size (mm) 350x80~250 460x80~330 535x80~390 535x80
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/cleanliness-test_topic1738_post7101.html
. And J-STD-001F have define ionic residue upper limit value(<1.56 micrograms/cm2) for Static Extraction Methods and manual method