Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Distributor / Manufacturer
Suppliers of inspection, test and manufacturing solutions including AOI, SPI, X Ray, and electrical test. Robotic soldering systems and materials for PCB assembly.
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
ProbeMaster is your complete solution to bare board electrical testing, allowing you to control the entire electrical testing process from beginning to end. ProbeMaster includes: Gerber data eding and CAM Netlist extraction, conversion and
Electronics Forum | Thu Jun 28 15:38:37 EDT 2012 | davef
Matthew: That you can get solder flow when hand soldering, but not when reflow soldering, seems to be telling you that you're not getting the connection warm enough during reflow. You need to have those connections liquidous + 20*C for at least 5 sec
Electronics Forum | Tue Feb 28 12:23:36 EST 2012 | veeckm
It sounds to me like your using only the Global fiducial mode. If your running multiple images on one panel use image fiducials instead
Used SMT Equipment | Pick and Place/Feeders
The parameters of the Star CP40LV patch machine Samsung CP40LV parameter Samsung CP40LV mount speed: 8000 CPH / H(IPC9850) servo system: servo motor drive X, Y axis-Z axis mobile drive system mount head: 3 mount heads, With fixed camera CP40LV Samsun
Used SMT Equipment | In-Circuit Testers
Thermotron Model SM-16-8200 Humidity Chamber, Auction Item: Major Auction July 20th Multiple Chambers Available:
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Industry News | 2011-12-14 15:47:27.0
Featuring new research and innovations in printed board design and manufacturing, electronics assembly and test, the IPC APEX EXPO® technical conference will be held at the San Diego Convention Center, February 28-March 1, 2012.
Parts & Supplies | Pick and Place/Feeders
we are selling FUji original nxt nozzle AA05600 FUJI NXT H08&H12 PICK UP NOZZLE0.45*0.3 AA05700 FUJI NXT H08&H12 PICK UP NOZZLE0.7*0.5 AA05800 FUJI NXT H08&H12 PICK UP NOZZLE1.0 AA20A00 FUJI NXT H08&H12 PICK UP NOZZLE1.3 AA06400 FUJI NXT H08&H1
Parts & Supplies | Pick and Place/Feeders
We are selling fuji original NXT nozzle : NXT H01 head nozzle 1 AA0AS00 FUJI NXT H01 PICK UP NOZZLE 1.0 2 AA05800 FUJI NXT H01 PICK UP NOZZLE 1.3 3 AA0MZ00 FUJI NXT H01 PICK UP NOZZLE 1.3MELF 4 AA06900 FUJI NXT H01 PICK UP NOZZLE 1.8 5 AA11R00
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2013-03-21 21:24:49.0
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. The paper explores the relative stress conditions on the distributed joints and the sensitivity to ball joint shape... First published in the 2012 IPC APEX EXPO technical conference proceedings
we have many panasonic feeder for cm402/602 machines in stock as below : 8mm double lane tape feeder with sensor, part No.KXFW1KS5A00, KXFW1KSBA00 without sensor. 12/16mm/emboss tape feeder with sensor, part No.KXFW1KS6A00, KXFW1KSCA00 without sen
we have many panasonic feeder for cm402/602 machines in stock as below : 8mm double lane tape feeder with sensor, part No.KXFW1KS5A00, KXFW1KSBA00 without sensor. 12/16mm/emboss tape feeder with sensor, part No.KXFW1KS6A00, KXFW1KSCA00 without sen
Career Center | Phoenix, Arizona USA | Production,Quality Control
Growing contract electronic manufacturer seeking to fill multiple positions: SMT Operator/Programmer Individual will determine and specify, revise and/or review, the most economic methods, operation sequence and tooling for the fabrication of pri
Career Center | Montreal, Quebec Canada | Engineering
Schneider Electric #28380 Process Specialist About Schneider Electric As a global specialist in energy management with operations in more than 100 countries, Schneider Electric offers integrated solutions across multiple market segments, inclu
Career Center | Fort Worth, Texas USA | Production,Technical Support
21 Years SMT experience proficient in ASM (Siemens) Si-place technology.
Career Center | Stouffville, Ontario Canada | Engineering,Maintenance,Management,Production,Purchasing,Technical Support
Innovation/Creativity Cost Saving Strategies Employee Motivation Customer Service Focus Program, Repair and Maintenance New Product Development Continuous Improvement Training & Development Process Planning & Labour O
Advances in Conductive Inks across Multiple Applications and Deposition Platforms SMTnet Express December 27, 2012, Subscribers: 26070, Members: Companies: 9073, Users: 34093 Advances in Conductive Inks across Multiple Applications and Deposition
New Developments in PCB Laminates Online Version SMTnet Express July 19, 2012, Subscribers: 25329, Members: Companies: 8927, Users: 33365 New Developments in PCB Laminates First published in the 2012 IPC APEX EXPO technical conference proceedings
| https://www.eptac.com/blog/eptac-premiers-a-sleek-new-look-at-the-2012-ipc-apex-expo-in-san-diego
EPTAC Premiers a Sleek New Look at the 2012 IPC APEX Expo in San Diego Looking for solder training standards, manuals, kits, and more
Lewis & Clark | https://www.lewis-clark.com/product/nordson-ace-kiss-103-ildp-selective-solder-2015/
Board Warp Compensation Step and repeat capability in both X- and Y-axis for multiple boards in a panel Heated nitrogen to the solder nozzle
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