Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Consultant / Service Provider
Founded in 2012, BetterGraph is a prominent digital marketing agency. We are headquartered in India and offer comprehensive services related to digital marketing.
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
Electronics Forum | Mon Jul 13 06:02:08 EDT 2015 | piyakorn
Hi All Some our customer has a new order but has been stopped long time ago (2012) which ENIG PCB in our raw material stock that are date code xx12 (still be vacuum sealed with silica gel) so,Will there be any risk or not? Help me please. Than
Electronics Forum | Fri Jul 24 16:33:45 EDT 2015 | cnotebaert
You should be fine! best practice for a situation like this would be to run a solder sample, either flux it and run through wave, or screen print, don't place parts and run through reflow. look for proper wetting characteristics if you see de-wetting
Used SMT Equipment | Soldering - Reflow
10 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed Control
Used SMT Equipment | Soldering - Reflow
13 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Dual Lane, Gen 5.2, OMS
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2012-09-13 09:35:40.0
GPD Global will exhibit in Booth #435 at the upcoming SMTA International Conference and Expo,
8.jpg)
Parts & Supplies | SMT Equipment
TAPE HOLDER ASM (CTF) Part Name：TAPE HOLDER ASM (CTF) Part No：E1310706CA0 Kindly contact me if you are interested. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086-13170471806
Parts & Supplies | Pick and Place/Feeders
YAMAHA 90K63-021606 Q2AA04006DCS2C TRACK WIDTH ADJUSTMENT MOTOR FOR YG100R YG100L MACHINE More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2012-06-07 21:44:28.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. IPC-175x Intent: To establish a standard data exchange format that will facilitate, improve, and secure data transfer between all members of a supply chain.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Training Courses | ON DEMAND | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
Events Calendar | Thu Aug 31 00:00:00 EDT 2017 - Thu Aug 31 00:00:00 EDT 2017 | Shenzhen, China
NEPCON and Smart Factory 1.0—The Future of Electronics Manufacturing
Career Center | Santa Cruz, California USA | Production
SMT operator wanted for first shift (6:00-3:30 +overtime) temp. to probable permanent postion. Quad equipment experience preferred. Candidate should have good organizational skills and attention to detail. Bilingual in Spanish and ability to solde
Career Center | Springfield, Virginia USA | Production
We need someone who is excellent at hand solder of through hole and SMT componets to pcb. Must be capable and content performing the task. IPC certification helpful but will accept experienced person that can perform the task to IPC standards.
Career Center | Moscow, Russia | Engineering,Management,Production,Quality Control
04.2011 - continue to work Moscow, - Instrumentation / electronics engineering procurement and contract manufacturing Supply production of components and materials. Placing orders for contract manufacturing of electronic products. Coordination of
Career Center | GARLAND, Texas USA | Production
exp in Fuji, Juki and universal smt pick and place machines . Component verification.
| https://pcbasupplies.com/cree-mx-led-nozzle-for-uic-lightning-with-urethane-tip-2012-1169/
Count On Tools 2012-1169 Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/calendar.asp?Y=2012&M=2
PCB Libraries Forum Events - February 2012 Forum Home > Events > February 2012 FAQ Search Events Register Login Events - February 2012 January February March April May June July August September October November December 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018
