Electronics Forum | Fri Jun 23 17:33:15 EDT 2023 | davef
OSHA legally requires employers to: * Monitor air quality * Restrict exposure * Maintain hazardous substance level below Permissible Exposure Level (PEL)
Electronics Forum | Sat Apr 15 00:10:52 EDT 2023 | sarason
Having worked in a hybrid maanufacturing operation many years ago, yes stencils are great and have the required accuracy, but on the down side there were 2 operators that were absolute wizzes at turning them out and that could mean up to 20 stencil
Used SMT Equipment | SPI / Solder Paste Inspection
SKU 16529 • Fastest solder paste inspection (SPI) system • Excellent 3D inspection • 3D SPI system for mid- to high-volume manufacturing • Great inspection ability of lead-free manufacturing process and fine-pitch/01005 compon
Used SMT Equipment | SPI / Solder Paste Inspection
TRI TR7007 3D Solder Paste Inspection Technology, SPI, Year 2011 Test Research Inc. (TRI) Dynamic imaging offers an improved solution for 3D SPI in term of accuracy, speed and field of view (FOV). The main advantage of dynamic imaging is that inspe
Industry News | 2023-08-14 12:26:47.0
See the Nordson Electronics Solutions equipment and talk to experts about the latest in fluid dispensing for semiconductor packaging at booth #L0800
Industry News | 2023-03-06 17:25:27.0
Kenneth Harris II, Eng.D. will deliver the opening keynote at Electrical Wire Processing Technology Expo (EWPTE). Acknowledged by Forbes Magazine as one of the world's youngest and most influential individuals in the field of science, he will present "Building the Future," on Wednesday, May 17, 2023, at the Wisconsin Center in Milwaukee, Wis.
Technical Library | 2023-03-27 19:18:38.0
Electronic waste (e-waste) is currently the fastest growing hazardous waste stream that continues to be a challenging concern for the global environment and public health. The average useful life of electronic products has continued to decline, and obsolete products are being stored or discarded with increasing frequency. E-waste is hazardous, complex and expensive to treat in an environmentally sound manner. As a result, new challenges related to the management of e-waste have become apparent. Most electronic products contain a combination of hazardous materials, toxic materials, and valuable elements such as precious metals and rare earth elements. There are risks to human health associated with the disposal of E-waste in landfills, or treatment by incineration. Americans discard 400+ million electronic items per year recycling less than 20 percent in safe and sustainable manner. E-waste is exported from developed countries and processed informally using unsafe conditions in many regions of developing countries. A mixture of pollutants is released from these informal rudimentary operations. Exposure to e-waste recycling includes the dismantling of used electronics and the use of hydrometallurgical and pyrometallurgical processes, which emit toxic chemicals, to retrieve valuable components. Thermal analysis integrated with chromatographic and spectroscopic techniques are used to determine dangerous chemicals emitted during the burning of e-waste. The information is used to assess the risk of exposure of workers at these semi-formal recycling centers.
Technical Library | 2023-06-14 01:09:26.0
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically.
Events Calendar | Thu Sep 07 00:00:00 EDT 2023 - Thu Sep 07 00:00:00 EDT 2023 | Chihuahua, Mexico
Chihuahua Expo & Tech Forum
Events Calendar | Thu Aug 17 00:00:00 EDT 2023 - Thu Aug 17 00:00:00 EDT 2023 | Independence, Ohio USA
Ohio Valley Expo & Tech Forum
Blackfox Training Institute, LLC | https://www.blackfox.com/guide-to-a-successful-lead-free-soldering/
new window Course Calendar Course Calendar 2024 Course Calendar 2023 IPC Certification IPC Courses IPC-A-600 IPC-A-6012 IPC-A-610 IPC-A-610 RECERT IPC/WHMA-A-620 IPC/WHMA-A-620 RECERT IPC/WHMA-A-620
| https://ipcapexexpo.org/exhibitors/exhibitor-information
, schedule one-on-one meetings with exhibitors and experience other offerings within the online exhibition. In order to provide you with optimal exposure for your brand, IPC has developed several advertising and sponsorship opportunities to help you connect and promote your products and services to virtual event attendees. Plan ahead
