Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/questions-answers_forum34&SO=V&OB=asc_page4.html
& IPCA610 Side Overhang By MSM_KOPF , 21 Apr 2022 at 1:31am 2 203 By MSM_KOPF 21 Apr 2022 at 10:33pm Help Identify This Component By bsorel , 18 Aug 2020 at 1
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
– Less expensive than Silver 209-217SnBi5Ag1+ 203-211SnBi5Ag1 210-216SnAg2.5Cu0.8Sb0.5 217SnAg3.88Cu0.7Sb0.25 217SnAg3.8Cu0.7 221SnAg3.5 227SnCu0.7 232Sn100 MELTING TEMPERATURE OR RANGE
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