949-07-15240 INVERTER SET B836E0163-2-2 GPD402 .75H/230 B836E0163-3-1 GPD402 .75H/230 B836E0165 JUSPEED-F BOARD CA133-3 F/V CONVERTER CA141-1 DUAL POWER SUPPLY CA224 ISOLATION BOARD CACR-15-YU1 SERVO PACK CACR-1R44SFB PCB CACR-IR151515EB SER
SGM-01VW12 SGD-A5AS SGDA-02VP SGDH-10DE SGDB-30VD SGD-04AS SGDA-02VS SGDA-08VS SGDB-15VDY1 SGM-04U3B4l SGDH-20DE SGDH-15DE SGD-08AS SGM-02V3B4 SGDB-30ADGY8 SGDB-20ADG SGDB-30ADG SGDB-05ADG SGDB-10ADG SGM-04A3S021 MRY01B-3 SGDB-1A
Used SMT Equipment | SMT Equipment
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg if need more info about the products , pls don’t
Used SMT Equipment | SMT Equipment
Model :KE-760 Placement speed：Chips:11, 250CPH(0.32sec/chip) Component mount range:1.0x0.5mm~□50mm or 50x150mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg if need more info about the products , pls do
Industry News | 2015-10-11 15:35:54.0
New placement modules, tapeless feeders, new screen printers and the first expert system that optimizes SMT processes automatically. At Productronica 2015 (November 10-13, Munich Trade Fair Center), technology leader ASM Assembly Systems will present a show unlike any other under the motto “On the move to the Smart #1 SMT Factory”. On 650 square meters at booth A3.377, the SMT experts will lay out their roadmap to the Smart Factory with a “Speed Quality” line and a “Flexible Quality” line featuring totally innovative technologies. The focus will be best-in-class equipment, automation tools, production process networking and integration, and transparent material logistics. At the “Speed Quality” line, new SIPLACE TX placement modules will ring in the mass placement of super-small 0201 (metric) components. A single SIPLACE TX module alone can place up to 78,000 of these per hour at full speed at smallest footprint. With its compact design, it also sets new records in speed, floorspace performance and placement accuracy. Components in sizes from 0402 through 01005 will be supplied loosely and without tapes thanks to the new SIPLACE BulkFeeder. This ASM innovation finally bans reels and splicing from the SMT production floor. With the DEK NeoHorizon and DEK NeoHorizon Back-to-Back, the ASM team will also unveil new, powerful screen printers. Most of the visitors’ attention, however, will be focused on the ASM ProcessExpert. This first inline expert system in the industry establishes a new product category in electronics manufacturing. By running virtual prints based on Gerber data, the ASM ProcessExpert subjects the stencil to a DFM (design for manufacturability) health check. By stabilizing and optimizing the printing process automatically, this highly innovative system represents a milestone on the path to self-optimizing SMT lines. Each of these innovations constitutes a building block for the Smart Factory.
Industry News | 2020-12-10 14:12:04.0
High temperature thin film resistors with an operating temperature up to 215 °C, provide high precision, tight TCR, and excellent stability
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Parts & Supplies | Screen Printers
Product Name: P0890; MPMVC1; VC2; VC3 bridge flow reactor Part Number: P0890 Description: P0890; MPM VC1; VC2; VC3 bridge flow reactor; DIODE, MODULE, 25AMP, 200V Applicable models: UP; AP Printing Presses P0890; MPM VC1; VC2; VC3 bridge fl
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Parts & Supplies | Screen Printers
Product Name: P0890; MPMVC1; VC2; VC3 bridge flow reactor Part Number: P0890 Description: P0890; MPM VC1; VC2; VC3 bridge flow reactor; DIODE, MODULE, 25AMP, 200V Applicable models: UP; AP Printing Presses P0890; MPM VC1; VC2; VC3 bridge fl
Technical Library | 2015-05-21 18:46:31.0
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.
SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress Mohammed A. Alam, Michael H. Azarian, Michael Osterman and Michael Pecht
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