Electronics Forum | Sun Oct 31 10:58:52 EDT 2010 | cobar
http://www.shanelo.co.za/Design,%20process%20and%20reliability.htm
Electronics Forum | Mon May 10 16:36:16 EDT 2004 | davef
Look here: http://www.aimsolder.com/techarticles/tech%20sheet%20BGA%20voiding-%20reducing%20through%20process%20optimization.pdf We have no relationship, nor receive benefit from the company linked above.
Used SMT Equipment | Board Cleaners
• Chemical isolation package • Torrid zone dryers • 480v/ 60Hz • Drip tray • 20” process width • Checkmate conveyor • Dual Hurricane nozzles • 15hp Hurricane rinse and wash jets • 15hp Torrid Zone Dryer/ plus (2) 3ph blowers and (1) 5hp blow
Used SMT Equipment | Soldering - Reflow
AUCTION ITEM / Negotiated sale for the continuing operations of MASTERWORKS Electronics Where: San Diego, CA When: 2/25-2/27 Large number of Assembleon, Heller, Dek and MPM machines. LATE as 2010 vintage 2010 vintage Heller MKIII reflow
Industry News | 2011-07-28 21:27:57.0
The SMTA proudly announces three upcoming offerings of SMT Certification in Schaumburg, Santa Clara, and Fort Worth.
Industry News | 2012-01-24 20:55:58.0
The SMTA proudly announces upcoming offerings of SMT Certification in Minnesota, Ohio, California, and Florida. The SMTA Certification program is unique as it recognizes and certifies the entire SMT assembly process at an engineering level.
Parts & Supplies | Chipshooters / Chip Mounters
4 1-479-850-11 .......... (PM-F24) SENSOR, MICRO (PM-F24) 1 PM-F24 5 1-479-861-11 .......... (PM-R24) SENSOR, MICRO (PM-R24) 2 PM-R24 6 1-763-911-11 .-... -. (SGMAS-C2ACA41) MOTOR, SERVO (SGMAS-C2ACA41) 1 SGMAS-C2ACA41
Parts & Supplies | General Purpose Equipment
35 4-706-725-11 ............ (M4X10) BOLT (M4X10), HEXAGON SOCKET 10 M4X10 36 4-706-725-61 ............ (M4X15) BOLT (M4X15), HEXAGON SOCKET 8 M4X15 37 4-706-726-11 ............ (M5X20) BOLT (M5X20), HEXAGON SOCKET 40 M5X20
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
