Industry Directory | Distributor
We are Selling Large Qty Of Brand New mobile phones laptpos plama TV with full Accessories {4gb/6gb/15gb/20gb/30gb and 60} also Mp3 Player, Mp4 Players with other Kinds of Ipods at Cheaper and affordable Prices.
New Equipment | Fabrication Services
Quantity: 10pcs Lead Time: 9 working days Number of layers: 2 layers Max board dimensions: 6300x3900mils/160x100mm Material: R-4, Tg130 Finished Thickness: 63mil/1.6mm Min Trace/space: 4mil/0.1mm Min.Holes size: 12mil/0.3mm Co
USB8550 USB-FP1 USB-AFC8513 AFP8550 AFP8551 PC-FP1 AFC8513 TSXPCX1030 TSXPCX3030 USBACAB230 USB-DOP DOP-USB DVPCAB215 DVPACAB2A30 DVPACAB630 DVPACAB530 DVPACAB515 PC-DOP DOP-DVP DOP-FX
Electronics Forum | Sun Jan 04 09:13:53 EST 1998 | Tach Shebby
Whether your buying or selling please take 5 min's to either call fax or visit our web-site. PUT US TO THE TEST !! Ph: 215-542-9821 Fx: 215-542-9824
Electronics Forum | Fri May 17 15:51:32 EDT 2002 | davef
First thing that comes to mind is that your �dip & look� testing at 240�C clearly doesn�t represent the in-use application of 215�C. So, what are the test results at 215�C? Other questions are: * Can we assume that the solderability of other compon
Used SMT Equipment | AOI / Automated Optical Inspection
This item is included in our July 5-10 Online SMT Auction. Please select the below link for more details on this sale. http://bajabid.hibid.com/catalog/134859/toggled-july-2018/?q=215
Used SMT Equipment | AOI / Automated Optical Inspection
This item is included in our July 5-10 Online SMT Auction. Please select the below link for more details on this sale. http://bajabid.hibid.com/catalog/134859/toggled-july-2018/?q=215
Industry News | 2013-09-12 14:24:27.0
GPD Global will exhibit in Booth #215 at the upcoming SMTA International Exhibition. Company representatives will demonstrate the latest in dispense technology from GPD Global's PCD line of continuously volumetric dispense pumps, along with its compact, versatile NCM5000 jetting series.
Industry News | 2013-10-08 18:35:41.0
GPD Global will debut its patent-pending FPC (Fluid Pressure Control) Dispensing System at SMTA International. FPC offers a breakthrough in uniform fluid dispensing by ensuring a consistent supply of fluid to the pump regardless of reservoir size or fluid level.
Parts & Supplies | SMT Equipment
Yamaha YG100 215A nozzle Pls kindly contact with us at any time, if you are insterest more info about products. Website : www.ksunsmt.com Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323 What's app: 15629932323
Parts & Supplies | Assembly Accessories
YAMAHA KGS-M7750-A1X YG100 TYPE 215A NOZZLE ASSY More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Equipment introduction: The second-hand placement machine CM212-M equipment comes from Europe and the United States. The equipment is mainly used to mount small components such as 0402. The equipment is new in the year, fast and well maintained. The
J9065189A TAPE GUIDE ASS`Y J9065190A TAPE GUIDE ASS`Y J9065191A LOCKER ASS`Y J9065192
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Events Calendar | Mon Jul 08 00:00:00 EDT 2024 - Mon Jul 08 00:00:00 EDT 2024 | ,
Heartland Chapter Technical Webinar: Virtual STAR Forum
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Career Center | Fairless Hills, Pennsylvania USA | Maintenance,Management,Technical Support
Qualmax Incorporated is looking for an experienced service manager to assume responsibilities for our SMT manufacturing products including; SMT Screen Printers, Pick and Place Assemblers, Reflow Ovens and Automatic Optical Inspection equipment. The
Career Center | Warminster, Pennsylvania USA | Management,Production
Process Engineering -Programmed, operated and maintained all automated assembly equipment (SMT, Selective Solder, conformal Coating) -Write procedures for above operation and maintenance. -Create and maintain all work instructions -Write ISO procedur
Career Center | , Pennsylvania USA | Engineering,Production,Quality Control,Research and Development
SKILLS Quote preparation for RFQ projects. Exposure to IPC A 610 and IPC A 600. Knowledge of Potential Failure Mode Effect Analysis (PFMEA), Process control plan (PCP) for new products, based on the Critical to Quality (CTQs). Knowledge in handli
SMTnet Express, February 12, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing Sabuj Mallik
SMTnet Express, February 27, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Position Accuracy Machines for Selective Soldering Fine Pitch Components Gerjan Diepstraten; Vitronics Soltec B.V. The drive towards fine pitch
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/5050696-simco-ion-replacement-kit-215-822-2171-222186?page=320&order=name+desc
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