Industry Directory | Distributor
PANASONIC CM202 CM402 CM602 Description: Original and brand new, large quantity of stock. # Nozzle 110F 115A 120 130 140 205 206A 225C 226C 230C 235C 240C for 8-Nozzle Head # Nozzle 110S 115AS
Industry Directory | Association / Non-Profit
IEEE-USA promotes the careers and public-policy interests of U.S. IEEE members.
New Equipment | Education/Training
BEST SMT training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature 0.062in thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This SMT tra
New Equipment | Education/Training
BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature
Used SMT Equipment | Pick and Place/Feeders
Model :KE-2070 Placement speed：Chips:16, 000CPH(0.225sec/chip) Ics:4,600CPH(0.7sec/IC) Component mount range:0.4x0.2mm~□33.5mm Station:80 Power supply:3P/200~415V/3KVA Size:1,400x1, 393x1, 455mm Weight:1,530kg
Used SMT Equipment | Pick and Place/Feeders
Model :KE-2070 Placement speed：Chips:16, 000CPH(0.225sec/chip) Ics:4,600CPH(0.7sec/IC) Component mount range:0.4x0.2mm~□33.5mm Station:80 Power supply:3P/200~415V/3KVA Size:1,400x1, 393x1, 455mm Weight:1,530kg
Industry News | 2003-03-10 08:41:03.0
provides an overview of the main features of both conduction coupling and radiated field coupling, the two primary RF immunity test methods.
Industry News | 2003-05-21 08:21:19.0
Basic concepts for identifying the relevant contributions to uncertainty, and the calculation of total uncertainty from these contributions
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
Technical Library | 2015-12-01 20:36:48.0
On January 1, 2015, nine months from APEX 2014, the production and use restrictions on HCFC-225 will be in effect throughout the United States. This phase out is encompassing in scope. This phase out will have significant technical, performance, and economic implications for the electronics industry. The regulatory situation remains fluid. A number of alternative solvents have been or are in the process of being developed. We discuss the options for assemblers and component manufacturers.
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
00349541-01 CLAMPING CARTRIDGE UNIT KP-12-600 00349542-01 VALVE MYH-3-0,9 LED 00349556S01 COMPRESSION SPRING 0,63x3,2x22,5 00349568S03 COMP.-VISION II SIPLACE 80F4. 00349584-03 COMP.MAGAZINE LONG LED 00349592-01 COMP.Magazine long W14,1 H1,7 LE1
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Career Center | Sugar Land, Texas USA | Production
Ability to assemble from blueprints/schematics. Previous experience with mechanical/electrical buildouts. Familiarity with tools and equipment for general assembly. Some positions require travel to the Austin, TX area for training. Living expense
SMTnet Express, December 3, 2015, Subscribers: 23,818, Members: Companies: 14,782, Users: 39,472 HCFC-225 Phaseout - What Now? Ed Kanegsberg; BFK Solutions LLC On January 1, 2015, nine months from APEX 2014, the production and use restrictions
