Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.
Electronics Forum | Fri Nov 30 06:16:25 EST 2007 | aj
Hi all, What do most of you aim for when profiling BGAs ? Currently I aim for time above 60 or 70 secs but I read a report that 40 secs would be more suitable. Also peak temp - I aim for 240-245 but again this report stated 230-235. any input app
Industry News | 2018-10-18 09:42:39.0
SMT reflow oven process principle and introduction
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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/grnreflo.pdf
°C and reaches full liquidus at a range of 230-235°C — a mere 5°C below the maximum allow- able temperature of 240°C. Maintaining such a small
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