Electronics Forum | Wed Dec 07 16:01:45 EST 2005 | JP
I am attempting to reball some PBGA's with no luck. The problem is getting the solder spheres to sit in the stencil apertures and removing excess spheres. I apply light amount of flux to pads of a BGA, align a stencil over a BGA, then pour solder s
Electronics Forum | Thu Mar 05 07:49:00 EST 1998 | Steve Gregory
Hi Ron, Your question really opens up a "Pandora's box", but when you say you're not able to print perfectly, what is it exactly that you mean? Is the print lacking volume? Is it mis-registered? Are you bridging? Also, what printers have you used? Do
Used SMT Equipment | Chipshooters / Chip Mounters
=1) Vision recognition ±0.04mm Feeder inputs Max. 80 on 8mm T/F*6 *1 Please ask for details on E size board. *2 When using MNVC. (option) *3 When using both high-resolution camera and MNVC. (option) *4 Effective
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. Show Details Solder Ball Defects Solder Ball Defects Show Details Reflow Soldering Problems The reflow soldering profile must be matched to the specific requirements of the solder paste as well as
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