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Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs
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"IPC training online, at your facility, or at one of our worldwide training centers including our brand-new training center in the Twin-Cities area of Minnesota. Blackfox Training."
Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Training online, at your facility, or at one of our worldwide training centers"
High Throughput Reflow Oven
Stencil Printing 101 Training Course
We specialize in servicing, providing modification, and spare parts to all major brands of SMT & AI equipment.
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating ��� Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
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[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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