Design and manufacture of electronic video overlay systems and stepper motor controllers
Wyles Hardy & Co. are consultant plant & machinery valuers & auctioneers specialising in the valuation and re-marketing of used equipment acting as agents on behalf of insolvency practitioners, financial institutions and private clients.
YAMAHA Refurbished YG100 Chip Mounter SMT Pick and Place Machine YAMAHA YG100 high-speed placement chip, high-precision, high-speed modular placement machine,high rigidity dual drive structure,High-performance servo system, high-resolution digital m
Refurbished Yamaha YV100 ll Pick and Place Machine Machine Type Automatic pick and place Brand Name Yamaha Machine Model YV100II Cycle Time Mix Comp. (Ideal) 0.198sec/chip CPH 12000 Ideal (
Electronics Forum | Wed Aug 06 17:45:54 EDT 2014 | rangarajd
Hello: Does any one have a soft copy of AMS 3.0 manual?
Electronics Forum | Tue Sep 19 15:11:16 EDT 2006 | d0min0
Hi there, we use inertec els 3.0 and 4.0 machines regards
Used SMT Equipment | Pick and Place/Feeders
Siemens S15 / F3 SMT Feeder Table Item Location: Tampa, FL USA
Used SMT Equipment | Pick and Place/Feeders
Make: Juki Model: KE-2030 Features: OS: WIndows NT SW: 3.0.1.8 Chip Shooter Location: Camarillo, CA USA
Industry News | 2003-05-05 09:21:23.0
Features a 50% Reduction in Length
Industry News | 2003-04-23 08:21:34.0
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.
Parts & Supplies | SMT Equipment
CABLE 100WAY NEXTMOVE-125374(3.0M)
Parts & Supplies | SMT Equipment
CABLE 100WAY NEXTMOVE-125374(3.0M) CABLE 100WAY NEXTMOVE-125374(3.0M Kindly contact me if you are interested. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086-13170471806
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
Make: Universal Model: Genesis GI-07S – 4992C (With PTF) Vintage: 2012 SW: UPS+ 8.3.0.10. Details: • Linear X/Y • 7 spindle head • Nozzle changer • Magellan 2.3 camera • PTF mounted on rear Visit www.lewis-clark.c
40001072 PIN ADJUST BELT(L) 40001076 SENSOR SLIDE PLATE 40001077 SENSOR BRAKET A 40001078 SENSOR BRAKET B 40001079 SENSOR BRAKET C 40001081 CENTERING PIN 4.0 40001082 CENTERING PIN 3.9 40001083 CENTERING PIN 3.8 40001084 CENTERING PIN 3.7 40
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BS in Engineering(3.0 GPA or higher), 3+ years in manufacturing enviornment, good communication skills, must be able to work at multiple tasks, ability to look at Big Picture. Duties/Requirements: Provide engineering expertise fo
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSCS w/3.0 min GPA, 0-2+ years experience using rational rose or similar OO case enviornment UML or comparable rotation scheme, Win NT, Networking communications, embedded systems; Must also know object oriented analysis, design
Career Center | maple heights, Ohio USA | Production,Technical Support
Certified SMT operator, experience in surface mount and through hole soldering, took courses in AC/DC Electronics, Electronic Devices I and II, Microprocessors, Programmable Logic Controllers, Electronics Communications Systems, Control Systems, Netw
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
widely adopted Sn-3.0Ag-0.5Cu solder alloys for
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-de/products/adhesive-dispensing-systems-products/universal-cf-nozzles
(0,012 bis 0,030 Zoll) Entfernung von Düse zu Substrat 12 bis 75 mm (0,5 bis 3,0 Zoll) Maximaler Hydraulikfluss 100 Gramm pro Minute pro Düse bei
