Industry Directory | Distributor / Manufacturer / Other
We are a franchised electronic components distributor. We specialize in passive, discrete and electro-mechanical components
Industry Directory | Manufacturer
Manufacturer of Power Conversion Products including, Rack-mount, Desktop and Industrial Power Supplies, DC-AC Inverters, DC-DC Converters & 3 Phase Battery Chargers
New Equipment | Board Handling - Conveyors
technical parameter： Model 1200 Track length 1200mm Supply power Ac220v/ single phase 50/60hz PCB size Wide 50-400 mm We
New Equipment | Board Handling - Conveyors
Model No: KSUN B350 Automatic vacuum loader MAX PCB`s capacity: 300pcs (0.6mm thickness PCB) cycling time: Approx 6 seconds Power supply: 100-230V AC (customized), single phase Power load: MAX 180 VA Air pressure: 4-6 bar Air volume: MAX 30L
Electronics Forum | Wed Jul 10 16:34:23 EDT 2013 | hegemon
Preheating is critical in Vapor Phase Soldering. One trick that is done is to use the "soft vapor" area just above the soldering vapor, some machines can pause just before going into the soldering vapor. Using that pause above the vapor to continue
Electronics Forum | Wed Aug 26 03:21:00 EDT 2009 | sergey2007
Hi Graham, the MSD level of the component is 3. I am not sure that my customer properly stored the component before the soldering process. And I am not sure that it was dried at all. The customer says they did everything that they had to, but I just
Used SMT Equipment | In-Circuit Testers
2005 Seica Pilot Flying Probe Tester O/S: Windows XP S/W: Viva 2.3.2.10 Top-Side Probes: 4 "Mobile" Bottom-Side Probes: 8 "Fixed" Power: 110VAC; 30A; 1 Phase or 230VAC; 14A; 1 Phase Air: Minimum = 73.5 PSI Machine Dimensions: 53" x 48
Used SMT Equipment | Soldering - Reflow
1997 Electrovert OMNI 7 Reflow Oven Left to Right 7 Heating Zones (Top & Bottom Heaters) Edge & Mesh Transport Power: 480 VAC; 101.2A; 60Hz; 3 Phase Machine Dimensions: 194" x 54" x 56" Serial: 11871242
Industry News | 2012-08-22 18:22:19.0
Following years of advocacy, IPC and its members are relieved that the conflict minerals rule approved by the U.S.
Industry News | 2013-04-17 11:13:48.0
IPC ESTC will feature eight professional development courses examining packaging, materials, design and assembly considerations in electronics, from bare board to end-product, May 20–21 and May 23, 2013, at The New Tropicana in Las Vegas.
Parts & Supplies | Assembly Accessories
Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub
Parts & Supplies | Semiconductor & Solar
JUKI JX-100LED SMT machine parameters High speed SMT machine JX-100LED Size of substrate Min. 50*50 ~ Max. 800*360mm The substrate positioning mode only corresponds to the contour reference mode Component height 12.0mm Component size 0201 (metr
Technical Library | 2022-01-19 17:50:20.0
pH and oxygen electrochemical sensors were evaluated in a ventilatory hypoxia rabbit model. The ventilator hypoxia protocol included 3 differential phases: basal (100% FiO2), the hypoxia-acidosis period (10% FiO2) and recovery (100% FiO2). Sensors were tested in blood tissue (ex vivo sensing) and in muscular tissue (in vivo sensing). pH electrochemical and oxygen sensors were evaluated on the day of insertion (short-term evaluation) and pH electrochemical sensors were also tested after 5 days of insertion (long-term evaluation). pH and oxygen sensing were registered throughout the ventilatory hypoxia protocol (basal, hypoxia-acidosis, and recovery) and were compared with blood gas metabolites results from carotid artery catheterization (obtained with the EPOC blood analyzer).
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
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Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 2 of 3)
Career Center | Addison,Texas, Texas USA | Engineering
Interface with development teams and provide input during the requirement and design phases for Tip/Ring line interfaces. Primary duties will include total hardware development starting from the requirements phase and ending with the test phase. Th
Career Center | Lowell, Massachusetts | Engineering
Our ISO 9001:2000 registered facility in Lowell, MA performs RF, Microwave, Digital, Mechanical, PCB fabrication and assembly/test of products using surface mount technology. We are seeking a qualified BSEE to join our team to assess and correct any
Career Center | Colton, California USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
• Strong experience with the installation, training, and repair on a variety of electro-mechanical, pneumatic, PLC, or computer controlled systems. • Strong Knowledge in SMT equipment, Screen Printer, AOI/SPI, Conformal Coat Systems, Reflow oven, X-R
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Proof Of Design a continuing column (saga) by The MoonMan Installment 3: DFM/CE Design Development Phases Continued from Front Page Sure, certain
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/9498-396-02415-main-switch-3-phase-n-210436?page=392&order=list_price+asc
ASSEMBLEON Main switch 3-phase + N 9498 396 02415 | QYSMT × Home about Us FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products Main switch 3-phase
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