New Equipment | Soldering Robots
ERSA POWERFLOW Wave Soldeing Machine Solder volume: 820 kg working width: 508 mm Weight: 2,200 bis 3,000 kg Dimension: 4,200 to 4,950x1,510x1,565 mm ERSA POWERFLOW Wave Soldeing Machine ERSA POWERFLOW Wave Soldeing Machine ERSA POWERFLOW Wa
Electronics Forum | Fri Oct 04 06:57:47 EDT 2013 | felo188
Hello, I am looking for datasheet of reflow oven - SMT 300c Thanks Lukasz
Electronics Forum | Fri Oct 04 12:22:46 EDT 2013 | hegemon
Can't find anything on this oven. You might try to contact a representative such as http://www.gemosz-elektronika.hu/eng/smd_machines_p.html Good luck!
Used SMT Equipment | Soldering - Reflow
Manufacturer: BTU Model: VIP70 Vintage: 1995 Configuration: Edge/Mesh Air 5 heating zones 300 C max temp Condition: Complete and Operational, “As Is Where Is” Availability: Immediately Available Location: USA/EXW
Used SMT Equipment | Soldering - Reflow
Heller Reflow Oven Model Number: 1700SX Serial Number: 0101DA-27810 Date: Jan 2001 6 Heating Zones 1 Cooling Zone Temperature: 300C Mesh Belt Conveyor Computer Controlled 208-240 Volts - 50/60 Hertz -3 Phase Dimensions: 11.2 x 4.
Industry News | 2012-05-09 13:58:34.0
A-Tek Systems Group introduces the new Kolb Cleaning Technology C-Class Cleaner Series PS300 to include 4 platforms to chose from: -VL, -VS, -HD, and -CA featuring PowerSpray® technology. The Kolb PS300 C-Class Cleaners are fully automatic, compact and cost competitive without sacrificing cleaning efficiencies and reliability.
Industry News | 2010-03-03 14:29:02.0
OK International (www.okinternational.com) has launched a new soldering system for PV tabbing and bussing applications proven to reduce micro cracking. The PS900 with specially designed hoof tip geometry optimizes the power delivered to the solder joint while it’s temperature-sensitive heater ensures low temperature soldering thus minimizing thermally induced stresses on cell surfaces.
Parts & Supplies | Assembly Accessories
FL Nozzle, SC-115X375X300/C60-CX Compatible with Flex and C4 Heads
Parts & Supplies | Assembly Accessories
FL Nozzle, SC-180X460X300/C60-CX Compatible with Flex and C4 Heads
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
• 5 Heating Zones. • Manual Hood Opening with Jack arrangement. • Max Temperature of 300˚C, Lead Free compatible. • Mesh (or) Chain (or) Chain above Mesh Conveyer options. • 10 independent PID controlled heating zones (5 Top
Model JBW-C Series Computer Screen Display Pendulum Impact Tester Application & Features: JBW-C Series Computer control Pendulum Impact Testing Machine were strictly designed according to national standard GB/T3038-2002 “ Inspection for pendulum Im
