Industry Directory | Manufacturer
a leading manufacturer of wafer handling tools for the global semiconductor industry. Our products include vacuum wands, wafer tweezers, HEPA vacuum pumps, etc. ESD safe products and tools for 300mm wafers are also available.
Industry Directory | Manufacturer
A leading supplier of manual vacuum handling solutions to the worlds high technology firms.
New Equipment | Test Equipment - Bond Testers
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av
New Equipment | Board Handling - Storage
A vacuum wand is a tool for gripping and holding a delicate miniature object securely without touching it with your hand. (cannot inhale like a vacuum cleaner!!) This means the object is not damaged. A vacuum pump connected to the wand body provides
Industry News | 2018-09-26 11:54:20.0
Virtual Industries now provides a product line of hand tools that replace tweezers or other gripping means for many applications. Ideal for handling wafers, disk media, flat panels, or any item that has a flat, hard surface, the SERIES 3 PORTA-WAND ELITE with 300 mm Wafer Tip VWT-5R-AR, handles up to 12" (300 mm) wafers, 110-220 VAC.
Industry News | 2009-10-31 01:46:24.0
COLORADO SPRINGS, CO — October 29, 2009 — Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, introduces the Extended Reach series of substrate handling tips for solar cells, wafers or flat panels.
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
Heller Industries Inc. | https://hellerindustries.com/automatic-pressure-curing-oven/
(option) Fully Automatic Loading with EFEM (300mm wafer) Your browser does not support the video tag. Pressure Curing Ovens PCO 500 PCO 520 PCO 1150 PCO 1280 PCO 1300 Parts Manual Automation
GPD Global | https://www.gpd-global.com/co_website/heatConfigurations.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
