New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
Electronics Forum | Sat Nov 04 20:17:25 EST 2000 | Greg G
Hi Guys, I'm sorry to ask you this, but I got mixed infos from the archive. I want to define a process in wave soldering regarding bd-wave interaction. Now "What's the required dwell Time of a lead in the solder bath?" Some says 3-5 secs is good, som
Electronics Forum | Fri Jul 23 01:32:21 EDT 1999 | KYUNG SAM PARK
HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED BY
Used SMT Equipment | SMT Equipment
Model:YG100Ra(FNC type) Placement Speed:8400cph(0.15sec/CHIP Equivalent) Placement Range:0402(Metric base )to□45mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L1650XW1562 Weight:1630kg jenny@ksunsmt.com
Used SMT Equipment | SMT Equipment
Name:YV88X middle speed multifunctional Chip mounter Placement Speed: Chips :6540cph(0.55sec/chip) QFPs:4000CPH(0.9sec /QFP) Placement Range:0.6X0.3mm~□54mm or 100x32mm Placement Station:94 Stations/Tray80 Power Supply:3P/200V-416V/KV
Industry News | 2020-02-18 13:44:35.0
In recognition and acknowledgement of his extraordinary contributions to IPC and the electronics industry, Steve Pudles, president and CEO, Zentech Manufacturing, was presented with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO on Tuesday, February 4 at the San Diego Convention Center. IPC’s most prestigious award, the Hall of Fame award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
Industry News | 2013-04-16 15:45:33.0
Get information on developing industry practices at IPC Conflict Minerals Update and It’s Not Easy Being Green conferences
Parts & Supplies | Circuit Board Assembly Products
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Parts & Supplies | Circuit Board Assembly Products
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
| https://www.smtfactory.com/P3-Semi-auto-SMT-Solder-Paste-Stencil-Printer-pd47448364.html
< 10 Sec. < 10 Sec. < 12 Sec. Power Consumption 200 W 200 W 200 W Power Supply 1 -PH, 220VAC 50/60HZ 1 -PH, 220VAC 50/60HZ 1 -PH, 220VAC 50/60HZ Air Pressure 4.5-6 kg/cm 4.5-6 kg/cm
| http://etasmt.com/cc?ID=te_news_news,26163&url=_print
) Tower lamp Manual width adjustment Double plate structure . SMEMA interface Controlled by PLC Pitch selectability (1 ~4 pitch) - 35 slots (+1 5mm) Jam detection (Pneumatic) OPTIONS Digital speed controller
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