Features of Refurbished JUKI JX-350 High Efficiency SMT Placement Machine Chip: 32,000CPH chip (Laser centering/Optimum); 21,000CPH chip (Laser centering / IPC9850). ■ From 0603 to 33.5mmsquare components. ■ JUKI laser centering for high speed,
ProntoSELECTIVE-SOLDERING is used by electronic manufacturers to quickly program their Selective Soldering machines. ProntoSELECTIVE-SOLDERING helps program most popular Selective Soldering machines such as ACE Production Technologies, RPS Autom
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Used SMT Equipment | AOI / Automated Optical Inspection
Make: Viscom Model: S3088 BAsic Vintage: 2016 Description: AOI
Used SMT Equipment | Screen Printers
This machine is included in the November 1-7 Online SMT Auction. Please select the below link to view the entire catalog for this sale. https://bajabid.hibid.com/catalog/147552/november-2018-online-auction/?
Industry News | 2003-02-26 08:37:36.0
An extended-height press-fit compliant pin SCA-2 receptacle is the latest addition to the SCA-2 product family.
Industry News | 2003-05-12 09:44:36.0
The actual number turned out to be substantially lower mainly due to internal personnel arrangements
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2024-11-06 16:37:36.0
The difference between the two manufacturing methods with pros and cons to using each.
Training Courses | ON DEMAND | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT) Recert.
The Certified IPC/WHMA-A-620 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Specialist (CIS) training.
Career Center | , | 2018-03-10 03:11:36.0
Required a Human Resource Professional for our HQ office with an experience of at least 2 years the field of Human Resources. MIS HR Administrator Assist in the Recruitment Process
Career Center | , Florida USA | Purchasing
Requires a professional with a minimum of 7 years of procurjement experience with PCB's, components, sheet metal etc. International procurement experience desired. Good systems experience. CPM certification a plus. BS or equivalent education and
Career Center | Harvard, Massachusetts USA | Engineering,Management,Production
Manufacturing management
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/products/selective-soldering-systems/cerno-105il
. Features and Benefits Selective soldering of printed circuit boards as large as 914 x 711 mm (36.0 x 28.0 in.) with the included carriers Heavy duty non-SMEMA edge conveyor to support added weight of large backplanes, PCBs or tooling fixtures Interchangeable solder pots and pumps compatible with tin-lead
