Industry Directory | Equipment Dealer / Broker / Auctions
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
New Equipment | Soldering Robots
Model: DH-800 Robot Automatic Dispenser product model： DH-800D Dispensing range： 300/300/90 maximum load Y/Z: 10KG/6KG Speed X& Y/Z(mm/sec) 500/500/300 external dimensions ： 465*495*697mm Body weight（KG): 42 capacity of decomposition ：0.01m
Electronics Forum | Tue Apr 27 11:53:36 EDT 2021 | dontfeedphils
When I was looking at Mirtec (4-5 years ago) I wasn't very impressed compared to Koh Young. It was easy to tell that Koh Young started with 3D and then added 2d features where needed, and that Mirtec had done the opposite. There's nothing wrong wit
Electronics Forum | Wed Jul 20 23:02:44 EDT 2016 | nipun92
We are trainee engineers doing research on the vi technology 5k and 5k 3d AOIs, we would like to know the advancements that they have made in the new 3d 5k AOI, and any setbacks if there are any.
Used SMT Equipment | AOI / Automated Optical Inspection
This 2015 Nordson YESTECH FX-940 Ultra 3D AOI is available for immediate purchase. For more information, please contact ashlin@bajabid.com
Used SMT Equipment | X-Ray Inspection
Test Research TRI, TR 7006L 3D Solder Paste Inspection, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM
Industry News | 2003-02-04 08:49:40.0
John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001
Industry News | 2003-06-17 08:07:40.0
The Radiall SMT coupler range now includes the new 14.2 x 5.1mm mini type.
Parts & Supplies | SMT Equipment
SAMSUNG SMT FOR SM421 LIGHT ELECTROMAGNETIC VALVE P/N:RCS242-M3-D24/NPJ6702049A
Parts & Supplies | SMT Equipment
SAMSUNG SMT FOR SM421 LIGHT ELECTROMAGNETIC VALVE P/N:RCS242-M3-D24/NPJ6702049A jenny@ksunsmt.com
Technical Library | 2023-09-15 10:06:49.0
Enhance your electronics manufacturing with our SMT On-line 3D Solder Paste Inspection Machine. Achieve unmatched precision and accuracy in solder paste inspection for optimal PCB assembly. Streamline your production process and minimize defects with cutting-edge 3D technology. Explore how this machine can revolutionize your soldering process and ensure top-quality electronics.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
► Exclusive15MP / 25MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue May 30 00:00:00 EDT 2023 - Tue May 30 00:00:00 EDT 2023 | ,
Wisconsin Chapter Webinar: 3D Printing Technologies and How It Relates to Our Industry
Events Calendar | Fri Jan 13 00:00:00 EST 2023 - Fri Jan 13 00:00:00 EST 2023 | Richardson, Texas USA
Dallas Chapter Technical Luncheon: 3D Printing of Tooling and Fixturing for the Manufacture of Electronics
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Experience in solid Edge CAD/CAM 3D system software and electronic packaging, Prior experience designing packaging systems a plus. Duties/Functions: Responsibility for the design of mechanical systems for electronic packaging. W
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Karachi, Pakistan | Engineering,Maintenance,Research and Development,Sales/Marketing,Technical Support
• Experienced in SMT Production, working on Siplace X Series-S and DEK-Micron Printer, on Siplace Pro and Siplace Explorer. • Having Strongly Skills of calibration of SMT machine, twin head, Multi star head, speed star head, gentry, Nozzles, feeders,
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
SMTnet Express, March 26, 2020, Subscribers: 35,188, Companies: 10,983, Users: 25,722 New High-Speed 3D Surface Imaging Technology in Electronics Manufacturing Applications Credits: FocalSpec, Inc. This paper introduces line confocal technology
SMTnet Express, October 11, 2018, Subscribers: 31,392, Companies: 11,058, Users: 25,281 3D Printed Electronics for Printed Circuit Structures Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, Kenneth Church; nScrypt Inc. Printed electronics is a
Lewis & Clark | http://www.lewis-clark.com/product-tag/3d-solder-paste-inspection/
: high to low Koh Young KY-8020T 3D Benchtop SPI Description: 3DBenchtop SPI Vintage: 2011 Details: Windows XP Operating System Software Version: 1.2.1206P06 Condition: Complete
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/copy-of-nordson-yestech-showcases-fx-940-ultra-3d-aoi-inspection-solution-at-productronica-2019
Nordson YESTECH Showcases FX-940 ULTRA 3D AOI Inspection Solution at Productronica 2019 YESTECH Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Automated Optical Inspection Conformal Coat Inspection Solder Paste Inspection Solutions PCB Assembly Aerospace Automotive Medical
