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BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
ProntoAOI is used by electronic manufacturers to quickly program their Automatic Optical Inspection (AOI) machines and X-RAY Equipment. ProntoAOI programs most popular AOI Equipment such as YESTech, Mirtec, Orbotech, Agilent, Omron, CyberOptics, Vi
If you have only Gerber data files to work with then ProntoGERBER-CONNECTION can help you! ProntoGERBER-CONNECTION imports raw Gerber data and allows the user to add intelligent information to the shapes on the display and create process assembly
Electronics Forum | Mon Sep 23 12:44:48 EDT 2002 | daanterstegge
Another issue to look at is the efforts that it takes to become familiar with the machine. Where I work we are also looking into AOI machines, and one of our requirements (based on how simple the vendors say their machines are) is that after no more
Electronics Forum | Fri Sep 20 14:23:50 EDT 2002 | larryk
PizzaFred, Scott mentioned lots of good ideas. Take one of your boards to each vendor and see what it takes to program the board how long it takes for it to become online. I've found some that are easy to program, but require 40 or more assemblies to
Used SMT Equipment | AOI / Automated Optical Inspection
This 2015 Nordson YESTECH FX-940 Ultra 3D AOI is available for immediate purchase. For more information, please contact ashlin@bajabid.com
Used SMT Equipment | AOI / Automated Optical Inspection
Capture on the fly technology 3D Fusion Lighting (RGB+White LED's) 5 megapixel color imaging 2 top-down and 4 side angle cameras Quick set-up High speed, high defect coverage Low false failure rate Programmable conveyor for boards up to 20 x 2
Industry News | 2003-02-04 08:49:40.0
John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | AOI / Automated Optical Inspection
Panasonic AI part AVK cover 101632300408 1 N510039140AB FIBER CFT0208 D3 conveyor track stop sensor 2 N510040164AB FIBER CFT0209 D3 conveyor track stop sensor 3 N510060977AA BELT TA-4UEB M/D 4.5WX990.0L D3 track conveyor belt (loss item) 4 N5100
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2017-08-28 17:14:41.0
PCB suppliers in the automotive space are vastly accelerating their time to market by using automated optical inspection (AOI) systems during PCB assembly. However, this next-generation technique is not limited in scope to the automotive industry – it has powerful implications for the entire PCB industry.
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► Exclusive 15MP CoaXPress Camera System ► OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology ► Leading-Edge 12 Projection Blue DLP Technology ► Precision Compound Telecentric Camera Lens ► Eight Phase Color Lighting System ► 10MP
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Career Center | Clifton, New Jersey USA | Engineering,Production
L3Harris is seeking an engineer to lead manufacturing and space vehicle integration related activities on the GPSIIIF and NTS3 program. The type of space flight hardware produced at this L3Harris location includes complex circuit card assemblies (CCA
Career Center | Los Angeles, California USA | Engineering
AOI Automated Test Equipment. Application and Process Engineer. Specialize in the technical aspects of all electronics industries. Specialize in all various products Operates all products such as reflow oven, KIC System, Hioki Testers, Saki AOI S
Career Center | la jolla, California USA | Engineering
More than 18 years experience in AOI. Refer to my resume for more details.
Career Center | , Portugal | Engineering,Maintenance,Production,Quality Control,Technical Support
SMT Process engineer Quality Efficiency Continuous improvement 11 years of experience in high volume production in a Japanese corporation Expertise in: Solder paste printing (DEK, Panasonic) Adhesive dispensing (FUJI, Panasonic) Components Pick and p
The Industry Requirement for 2D and 3D Inspection Technology in a Single AOI Platform SMTnet Express November 21, 2012, Subscribers: 26000, Members: Companies: 9045, Users: 33968 The Industry Requirement for 2D and 3D Inspection Technology in a
Baja Bid | https://bajabid.com/product-tag/3d-aoi/
3D AOI Archives - Baja Bid LLC Skip to content Your EMS Asset Management Partner Careers | Current Auctions Linkedin page opens in new window Baja Bid LLC Your EMS Asset Management Partner Home About Services Managed Online Auctions Asset Analysis Consignment Program Cash Buyout Program
Lewis & Clark | http://www.lewis-clark.com/product-tag/3d-aoi/
3D AOI Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
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