Industry Directory | Equipment Dealer / Broker / Auctions
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Industry Directory | Equipment Dealer / Broker / Auctions
Capital Equipment Solutions - SMT | PCBA | TEST
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
New Equipment | Solder Paste Stencils
Semi Auto SMT PCB Solder Paste Printing Machine Model 500mm 800mm 1200mm 1500mm Direction Left → Right, Right → Left Power Single phase 220V, 50/60Hz,100W Translational speed 0-2200mm/mins
Used SMT Equipment | Visual Inspection
Condition: Complete & Fully Operational
Used SMT Equipment | X-Ray Inspection
Test Research TRI, TR 7006L 3D Solder Paste Inspection, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM
Industry News | 2003-06-17 08:07:40.0
The Radiall SMT coupler range now includes the new 14.2 x 5.1mm mini type.
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Technical Library | 2023-09-15 10:06:49.0
Enhance your electronics manufacturing with our SMT On-line 3D Solder Paste Inspection Machine. Achieve unmatched precision and accuracy in solder paste inspection for optimal PCB assembly. Streamline your production process and minimize defects with cutting-edge 3D technology. Explore how this machine can revolutionize your soldering process and ensure top-quality electronics.
Technical Library | 2016-01-12 11:04:35.0
3D packaging has recently become very attractive because it can provide more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize devices and meet the demand of high speed, provide more memory, more function and low cost. With the advancement of 3D packaging, the bump height is now down from 80μ to 10μ. When the bump diameter is 20-40μ and height 10μ, the process and reliability are obvious issues. It is well known that underfill can enhance the reliability for regular flip chip, however underfill won’t help assembly process. In order to resolve some difficulties that 3D packaging faces, YINCAE Advanced Materials, LLC has developed solderable anisotropic conductive adhesives for 3D package applications. In this paper we will discuss the assembly process and reliability in detail.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Sat Sep 26 18:30:00 UTC 2020 - Wed Sep 30 18:30:00 UTC 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Events Calendar | Sun Jun 09 18:30:00 UTC 2024 - Sun Jun 09 18:30:00 UTC 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
Career Center | Los Angeles, California USA | Engineering
AOI Automated Test Equipment. Application and Process Engineer. Specialize in the technical aspects of all electronics industries. Specialize in all various products Operates all products such as reflow oven, KIC System, Hioki Testers, Saki AOI S
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | , Arizona USA | Production,Quality Control
Surface Mount Machine Operator Operate several machines daily in the front end production line Continuous adjustments to machines and quality checks of that such product Daily logs of production on computer and proper paperwork to document q
Career Center | rawalpindi, Pakistan | Production
Handling the production line including two SWISS pick and place machines cobra and paraquda ,tucano printer reflow oven ,samsung loader and unloader.Hand on experience with 3D camera inspection system and solder paste height measuring instrument and
SMTnet Express, October 27, 2022, Subscribers: 24,948, Companies: 11,636, Users: 27,518 █ Electronics Manufacturing Technical Articles 3D Printed Electronics for Printed Circuit Structures Printed electronics is a familiar term
SMTnet Express, March 26, 2020, Subscribers: 35,188, Companies: 10,983, Users: 25,722 New High-Speed 3D Surface Imaging Technology in Electronics Manufacturing Applications Credits: FocalSpec, Inc. This paper introduces line confocal technology
Baja Bid | https://bajabid.com/product/2016-cyberoptics-se600-solder-paste-inspection/
2016 CyberOptics SESE600 3D Solder Paste Inspection Solder Paste Inspection - Baja Bid LLC Skip to content Your EMS Asset Management Partner Careers
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/nordson-yestech-to-debuts-fx-500-ultra-3d-solder-paste-inspection-solution-at-apex-2018
Nordson YESTECH to Debuts FX-500 Ultra 3D Solder Paste Inspection Solution at APEX 2018 OPTICAL Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Automated Optical Inspection Conformal Coat Inspection Solder Paste Inspection Solutions PCB Assembly Aerospace Automotive Medical
