Industry Directory | Manufacturer / Other
A small business that offers design engineers PCB prototypes with few restrictions. Our PCB's will be similar to the electrical characteristics and constraints that are being designed for and required in today's high speed and RF circuits. We offer up to 8 layers, hidden vias, over 20 choices of board thickness' and materials. Geometery as small as 4 mil lines & 4 mil spacing.
Industry Directory | Manufacturer
Lakeside Sales offers extensive capabilities for PCB's. Quick turn to production. DS to microelectronics ; 4 mil laser drill,
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Fabrication Services
Flex part 2Layer PCB Polymid PCB thickness: 0.15mm Yellow coverlayer White Silkscreen Surface treatment: ENIG Min Line/space: 6/6mil Min hole: 4mil Rigid part 6Layer PCB PCB thickness: 0.8mm Green solder mask White Silkscreen Surface treatment: ENIG
Electronics Forum | Thu Apr 29 11:07:03 EDT 2004 | arcandspark
You are right about the very poor support for smaller customers. I had told them we were looking for another paste and now they have sent the reginal manager and the US sales manager has come by to see what they can do for us. All they keep saying is
Electronics Forum | Tue Apr 13 08:25:15 EDT 2004 | arcandspark
I would have gone to a .004" stencil but again, the board designers, which we have no control over or are we allowed to give input to, have made the pads on all connectors and many other parts so small that we are almost seeing insuffecient solder us
Used SMT Equipment | Pick and Place/Feeders
Configuration: • S/W 3.2.3b • OS2 • 1 Flex head • 4mil front camera • 4mil rear stadium camera • 2 nozzle changers • Banks 3 & 4 upgraded to 630 VME vision Condition: Complete and Operational, “ As is Where is”, 30 day repair/exchange warrant
Used SMT Equipment | Pick and Place/Feeders
(4) Universal Instruments GSM2 Pick and Place Machines in Good Running Condition Machines are complete and come with Feeder Carts and Feeders Machine 1 - Model Number: GSM2 - Dual Beam - Q Block - (2) 7 Spindle FlexJets - (2) 2.6 mil upper lookin
Industry News | 2003-04-15 08:39:15.0
Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)
Industry News | 2003-03-25 09:15:19.0
The Dragon was demonstrated at the CPCA show in Shanghai last week
Parts & Supplies | Repair/Rework
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50? angled a
Parts & Supplies | Pick and Place/Feeders
GSM Multi Pitch Feeder 16mm 47175802 we also supply other Universal accessories (GSM): part no description 46485701 CAMERA(PEC) 45269201 PC BD,PEC ILLUM ASSY 47598301 FLEXJET CLUTCH (OLD) 50121203 FLEXJET MirrorCLUTCH(NEW) 47509501 THETA ENCOD
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
Technical Library | 2015-03-12 18:26:16.0
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are many ways to increase the packaging density and a few examples would be to stack them with Package on Package (PoP), fine pitch CSP's, 01005 and last but not least reduced component to component spacing for active and passive components (...)This paper will discuss different layouts, assembly and material selections to reduce component to component spacing down to 100-125um (4-5mil) from today’s mainstream of 150-200um (6-8mil) component to component spacing.
Make: Universal Instruments Model: Advantis 4982C Vintage: 2006 PEC Camera Single Beam Advanits – Lead Screw FlexJet 7 Spindle Head with 2.6 mil Camera Condition: Complete & Operational Location & Shipping: Nashua, NH / FOB Origin A
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Career Center | Houston, Texas USA | Production
Electronic Assemblers / Solderers Temp to hire opportunity! $11 - $13/hour Job Responsibilities 1.) Solder rf, gps and gsm antenna, ps pigtail, fiber leds, buzzer 2.) IPC-610 or mil spec experience a plus 3.) Glue units together 4.) Cut open
Career Center | Tulsa, Oklahoma USA | Engineering
Our client has an immediate need for an SMT Process Engineer in Tulsa, OK The company is a recognized leader in the electronics manufacturing services industry. They are a proven provider of complete, solutions-oriented contract manufacturing servic
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Fallbrook, California USA | Sales/Marketing
I have over 5 years of experience as the Asian Regional Vice President of Sales and Marketing for the Siemens SMT equipment division, over 7 years as the President of a small international Manufacturers Representative business selling SMT machines in
| https://unisoft-cim.com/crosschecking-pcb-component-footprint-and-bom-footprint.html
980 mils span from part number (MPN P/N preferred) 381200-66-4 0 mils span from part number (MPN P/N preferred) 381212-44-1 770 mils span from part number (MPN P/N preferred) 385848-05-6
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
3M High Performance Adhesive Transfer Tapes with Adhesive 200MP Adhesive Adhesive Liner Liner Product Type/ Thickness2 Color, Type, Caliper3/ Number Color1 (mils, mm
winsouce.jpg)