Industry Directory | Manufacturer / Other
A small business that offers design engineers PCB prototypes with few restrictions. Our PCB's will be similar to the electrical characteristics and constraints that are being designed for and required in today's high speed and RF circuits. We offer up to 8 layers, hidden vias, over 20 choices of board thickness' and materials. Geometery as small as 4 mil lines & 4 mil spacing.
Industry Directory | Manufacturer
Speedy Circuits manufactures technically demanding PCBs, flex & rigid-flex circuits, metal core boar
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Fabrication Services
Quantity: 10pcs Lead Time: 9 working days Number of layers: 4 layers Max board dimensions: 6300x3900mils/160x100mm Material: R-4, Tg130 Finished Thickness: 63mil/1.6mm Min Trace/space: 4mil/0.1mm Min.Holes size: 12mil/0.3mm Co
Electronics Forum | Sun Mar 07 13:10:15 EST 1999 | Sam Sangani
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Electronics Forum | Fri Feb 26 04:02:16 EST 1999 | Terry Keen
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Pick and Place/Feeders
Configuration: • S/W 3.2.3b • OS2 • 1 Flex head • 4mil front camera • 4mil rear stadium camera • 2 nozzle changers • Banks 3 & 4 upgraded to 630 VME vision Condition: Complete and Operational, “ As is Where is”, 30 day repair/exchange warrant
Industry News | 2003-03-12 09:03:48.0
Demand for the material, used in PCBs, is increasing because of folding mobile phones and other devices
Industry News | 2003-03-25 09:15:19.0
The Dragon was demonstrated at the CPCA show in Shanghai last week
Parts & Supplies | Repair/Rework
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50? angled a
Parts & Supplies | Screen Printers
Product Name: MPM momentum folder side 1016013/14-04 Part Number :1016013-04; 1016014-04 Description: MPM momentum folder side 1016013-04; 1016014-04 Applicable models: momentum; 125 MPM folder side 1 MPM AccuFlex folder side L = 455mm MP
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
Technical Library | 2018-08-15 17:27:28.0
Smartphones and tablets require very high flexibility and severe bending performance ability of the flexible printed circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs, the extraordinary highly flexible, treated rolled-annealed (RA) copper foils have recently used instead of regular RA foil and electro deposited foils. It is very important to measure the Young's moduli of these foils predicting the mechanical properties of FPCs such as capabilities of fatigue endurance, folding, and so on. Even though the manufacturers use IPC TM-650 2.4.18.3 test method for measuring Young's modulus of copper foils over many years, where Young's modulus is calculated from the stress–strain (S–S) curve, it is quite difficult to obtain the accurate Young's modulus of metal foils by this test method.
Make: Universal Instruments Model: Advantis 4982C Vintage: 2006 PEC Camera Single Beam Advanits – Lead Screw FlexJet 7 Spindle Head with 2.6 mil Camera Condition: Complete & Operational Location & Shipping: Nashua, NH / FOB Origin A
03016339S07 COMP.CAMERA P+P (TYP33) 55x45 digit. 03016517-01 RETROFIT KIT INDUCTOR MTC2 03016518-01 RETROFIT KIT INDUCTOR MTC1 03016644-02 Computer Unit Basis X-Serie PFII+ 03016710-01 SET VOLTAGE RED. OF OBLIQUE LIGHTING 03016724-02 COMPUTER UN
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Career Center | Houston, Texas USA | Production
Electronic Assemblers / Solderers Temp to hire opportunity! $11 - $13/hour Job Responsibilities 1.) Solder rf, gps and gsm antenna, ps pigtail, fiber leds, buzzer 2.) IPC-610 or mil spec experience a plus 3.) Glue units together 4.) Cut open
Career Center | Tulsa, Oklahoma USA | Engineering
Our client has an immediate need for an SMT Process Engineer in Tulsa, OK The company is a recognized leader in the electronics manufacturing services industry. They are a proven provider of complete, solutions-oriented contract manufacturing servic
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/03003124-flap-foil-disposal-226257?page=4&order=list_price+asc
SIEMENS Flap/Foil Disposal 03003124 QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products Flap/Foil Disposal Public Pricelist Public Pricelist Flap/Foil Disposal
Heller Industries Inc. | https://hellerindustries.com/parts/3786k/
3786K - FOIL BACKED FIBERGLASS INSULAT - Sheet Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
