New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
Electronics Forum | Thu Jun 24 15:44:12 EDT 1999 | Earl Moon
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Thu Jun 24 13:12:15 EDT 1999 | MD Cox
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Industry News | 2011-06-07 14:37:33.0
LPKF will exhibit its ProtoMat S63 and ProtoLaser S in Booth #2202 at the upcoming IEEE Microwave Theory & Techniques Society (MTT-S) International Microwave Symposium for 2011 (IMS2011), scheduled to take place June 7-9 2011 at the Baltimore Convention Center in Baltimore, Maryland.
SP1-W : HIGHT PERFORMANCE & FLEXIBLE PRINTING SAMSUNG C&T AUTOMATION Address: 17835 SKY PARK CIRCLE, SUITE E, IRVINE, CA 92614 Office # : 949-222-2201 Homepage: Http://www.samsungsmt.com
| http://www.thebranfordgroup.com/dnn3/Auctions/PastSales/tabid/58/Default.aspx
& Boring Mills, Kuka Robot, (14) Bridge Cranes, Plant Support Equipment as new as 2018 Dallas, TX Powerpro Engineering [Online] SOLD - Auction Closed on 5/18/2021 Complete Closure of Chicago SMT Facility New ‘18 Samsung SM481+ and ‘15 Samsung SM482 (50
.gif)
