Industry Directory | Manufacturer
Sprint Circuits,a high technology PCB manufacturing company,Since 2001.Our advantages are quick turn,Thick copper(up to 6oz) ,impendace control and high precision from 6layer to 12layer boards.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
Dual Lane SMT Reflow Oven Nitrogen soldering process dual rail conveyor Weight Appx.:3060Kg Dimension 6300*1680*1530mm Product description: 10 Zones Dual Rail Nitrogen SMT Reflow Oven KTR-1000D-N Manufacturer, Nitrogen soldering process, dual
Electronics Forum | Mon Apr 22 16:31:53 EDT 2013 | anvil1021
So, I was wondering how thick 2 oz. Copper is supposed to be? I have heard 60 microns and 70 microns, but the PCBs that we have that are supposed to be 2oz Copper are 68.5 microns, the Customer would like at least 60 microns, but what is the reality
Electronics Forum | Mon Apr 22 17:13:48 EDT 2013 | hegemon
Might want to double check my figures, but my notes have 2oz copper at 2.8 mils or 71.12 microns in thickness. 'hege
Used SMT Equipment | SPI / Solder Paste Inspection
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Used SMT Equipment | General Purpose Equipment
Package offers preferred: 1.) Protomat S103 Jetstream Dust Extraction System 4 Replacement Bags 3 new Vacuum table backers 1 used tight tolerance vacuum backer with sinter plate Solder Paste Dispensing attachment Upgraded to new Aluminum work
Parts & Supplies | Assembly Accessories
PC12P Inventory Material: Copper Clad FR4, Single Sided, 2 oz. Series: - Size Dimension: 18.00" x 12.00" (457.4mm x 304.8mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: Copper Clad, Positive Sensitized PC12P-E RFQ
Parts & Supplies | Other Equipment
AI universal parts 40727505 46737003 SCRAP HOUSING ASSY, OFFSET 46737103 SCRAP HOUSING ASSY, "T" STYLE 46750601 COVER, CLINCH OFF 46750901 COVER, CLINCH VSL 46757801 PICKER AXIS MTR ASSY 46757901 X AXIS MTR ASSY 46758001 Y AXIS MTR ASSY 467
Technical Library | 2023-11-14 19:52:11.0
The continuous drive in the Electronics industry to build new and innovative products has caused competitive design companies to develop assemblies with consolidated PCB designs, decreased physical sizes, and increased performance characteristics. As a result of these new designs, manufacturers of electronics are forced to contend with many challenges. One of the most significant challenges being the processing of thru-hole components on high thermal mass PCBs having the potential to exceed 20 layers in thicknesses and have copper mass contents of over 40oz. High thermal mass PCBs, coupled with the use of mixed technologies, decreased component spacing, and the change from Tin Lead Solder to Lead Free Alloys has lead many manufacturing facilities to purchase advanced soldering equipment to process challenging assemblies with a high degree of repeatability.
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
Guillotine type V-cut PCB Cutting Machine Product Description 1. For internal strength generates during separation, Minimize it to value under 180uE ,to avoid solder crack or component damage 2. Able to separate edge of V-slot, minimum distance to
V Cut PCB Depaneling Aluminum Cutter Machine For LED Printed Circuit Board LED PCB Separator Features: 1. Separates panels up to 0.1" 2. The longest panel: No limit 3. Minimum board thickness of 0.024" 4. Shears boards safely with parts as clo
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/-/media/Files/Nordson/efd/Products/Data-Sheets/Thermal-Compound/Nordson_EFD_Thermal_Compound_Selector_Guide.pdf?la=en
. Thermal compound can be packaged in any size Nordson EFD syringe barrel or cartridge along with 6 oz jars and 1 and 5 gallon pails. How thermal compound (interface material
