Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup
Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
: 1/03/01 Candidate Alloy Melting Temperatures No Lead Characteristics • Slightly Stronger • Comparable Fatigue Life to 63/37 • Coarser Grain Structure
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/3-things-you-should-know-about-lead-free-soldering/
. Reasons Why Lead Solder Was The Preferred Solder Type Lead solder is an alloy commonly made up of 63% tin and 37% lead. It is sometimes referred to as Pb-Sn, its chemical formula
