Industry Directory | Manufacturer
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
Datum Alloys is an international supplier of speciality metals and special purpose alloys,
New Equipment | Solder Paste Stencils
SMT Framed Stencils are laser cut solder paste stencils designed to work on SMT printing machines. These laser cut stencils are permanently glued into a frame. These framed stencils are are designed for highly repeatable continuous operation in volum
New Equipment | Solder Paste Stencils
SMT Foil Stencils are laser cut solder paste stencils designed to work on their own for hand printing or with stencil tensioning systems. These laser cut stencils do not need to be permanently glued in a frame. These so-called frameless stencils are
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Used SMT Equipment | Soldering - Reflow
Features 1. Full hot air reflow heat fast, high thermal efficiency compensation, delta t less than ± 2 ℃ soldering is uniform. 2. HELLER company has 40 years of history, process maturity. 3. maintenance costs low, the furnace normal use, electrici
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Industry News | 2003-02-24 09:32:24.0
Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.
Technical Library | 2019-03-06 21:26:14.0
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However, variability in the mechanical properties such as the coefficient of thermal expansion and elastic modulus effects the material selection process by introducing uncertainty to the long term impacts on the reliability of the electronics. Typically, the main reliability issue is solder joint fatigue which accounts for a large amount of failures in electronic components. Therefore, it is necessary to understand the effect of polymer encapsulations (coatings, pottings and underfills) on the solder joints when predicting reliability.This paper presents the construction and validation of a thermo-mechanical tensile fatigue specimen. The thermal cycling range was matched with potting expansion properties in order to vary the magnitude of tensile stress imposed on solder joints
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
This is video shows how to print a PCB using a prototype foil only stencil. The SMT prototype stencil (www.soldertools.net) is made from a high nickel content material able to offer repeatable high precision apertures. The steps of alignment, printin
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
Events Calendar | Tue May 30 18:30:00 UTC 2023 - Tue May 30 18:30:00 UTC 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Cleveland, Ohio USA | Management,Purchasing,Sales/Marketing
Content Procurement Manager Negotiates to acquire rights to utilize content for electronics assembly industry web site. Contacts identified sources and promote benefits of web site as a vehicle for publication and distribution of materials. Sources
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Building from its strengths in material
Career Center | Norfolk, Virginia USA | Engineering,Maintenance,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support
Jay Selter Test Engineer / Technician; Formal Education: Schools and Courses completed. BROOKLYN TECHNICAL HIGH SCHOOL, NEW YORK: Electrical engineering design (two year major): Meter design and construction; Transformer design and materials; Moto
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_wave_solder_vitronics.html
) Heat-up Time of Solder Bath: Approx. 2.5 hours to reach 250 degrees c (482 degrees F) for eutectic 63/37 solder, by 3 heating elements (1 kW each
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
et al. “Evolution of thermal interface materials for advanced packaging“, Chip Scale Review, pp.55-60, May-Jun 2021 [7] Deppisch et al., “Material Optimization and Reliability Characterization of an Indium-Solder TIM for CPU Packaging” pp 67-74, JOM
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