Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/61?order=list_price+asc
0.0 CNY FILTER ELEMENT PF3-24-005-01 ¥ 0.00 0.0 CNY Solder Paste 96.5Sn/3Ag/0.5Cu ¥ 0.00 0.0 CNY Solder Paste 63Sn/37Pb ¥ 0.00 0.0 CNY Prev 58 59 60 61 62 63 64 Next products and services Surplus placement machine SMT peripheral equipment product information contact us
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
2X rework1,2. This however, was only required on an extremely small percentage of card types. The majority of PTH reworks were capable of using the one alloy type (i.e. eutectic 63Sn-37Pb). However, now with having to use Pb-free alloys such as SAC305
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