Electronics Forum | Tue Sep 28 04:10:26 EDT 1999 | Wolfgang Busko
| | | | | | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shield
Electronics Forum | Tue Sep 28 06:36:35 EDT 1999 | Earl Moon
| | | | | | | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shie
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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& Leo Soldertips Why Get IPC Certified Blog Webinars FAQ’s About Us Instructors Consulting Services Customized Training Press Releases Careers Contact 5 Industries Evolving Due to Automation November 10th, 2020 As automation continues to rise, future jobs
