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Electronics Forum | Wed Aug 04 10:19:51 EDT 2004 | davef
Consider: * Reducing the size of the pads * Reducing the amount of solder paste * Inspecting the print. A print with irregular form (eg, print finishes with a tail, the print is inclined or something like that) * Too long in the reflow zone * Bad ali
Electronics Forum | Thu Aug 05 04:51:37 EDT 2004 | Bryan
The ball pitch is 1.10mm and the pad diameter is 0.45mm,so we designed the aperture diameter as 0.45 on 0.13mm thick stencil.Bridging rate decreased a great deal,but the balls still deformed in the same area.and found it no use reducing the reflow ti
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ASYMTEK Products | Nordson Electronics Solutions
