New Equipment | Industrial Automation
Yokogawa DCS CS1000 CS3000 ： AAI141 AAV141 AAV142 AAI841 AAB841 AAV542 AAI143 AAI543 AAV144 AAV544 AAT141 AAR181 AAI135 AAI835 AAT145 AAR145 AAP135 AAP149 AAP849 ADV151 ADV551 ADV141 ADV142 ADV157 ADV557 ADV161 ADV561 ADR541 CENTUM：ADV85
Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef
There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | AOI / Automated Optical Inspection
S/N 60075 & S/N 60076 These 2 units came off the production floor in full operation. They were properly shut down secured and shipped to the Midwest warehouse and a dual set of Calibration Jigs are also available. Inspection available upon requ
Industry News | 2013-01-17 11:33:20.0
Viscom today announced plans to debut the new S6056 XM AOI system with new 65 MegaPixel ultra-high-speed camera head in booth #3133 at the upcoming IPC APEX EXPO
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Parts & Supplies | Pick and Place/Feeders
NXT H12 3.7 nozzle AA740 01 SWPH-9510 CP6/S PICK UP NOZZLE 0.7 02 SWPH-9520 CP6/S PICK UP NOZZLE 1.0 03 SWPH-9530 CP6/S PICK UP NOZZLE 1.3 04 SWPH-9550 CP6/S PICK UP NOZZLE 1.8 05 SWPH-9541 CP6/S PICK UP NOZZLE 1.
Parts & Supplies | Pick and Place/Feeders
NXT nozzle NXT-H01-7.0G (AA07300/AA07310) Spare Name: AA07300 AA07310 NXT-H01-7.0G Specifications Model: NXT NOZZLE Head H01 Dia 7.0G. FUJI NXT H01 PICK UP NOZZLE ¢ Applicable models: FUJI NXT H01 AA0AS00 FUJI NXT H01 1.0 AA05800 F
Events Calendar | Tue Nov 09 00:00:00 EST 2021 - Tue Nov 09 00:00:00 EST 2021 | ,
Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications
Events Calendar | Tue Nov 09 00:00:00 EST 2021 - Tue Nov 09 00:00:00 EST 2021 | Chelmsford, Massachusetts USA
Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications
