Electronics Forum | Sat May 28 04:56:23 EDT 2005 | WDLau
Dear, I am looking for the supports, specification, etc of the solderiability of Hot bar Reflow process with: A). FPC plating with sb/pb= 90/10, to be mounted to B) B). Golden plating PCB Please kindly input, As far as I know the melting point of
Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef
Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during
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