Our experienced engineers and technicians can craft processes that require a variety of surface mount technology (SMT) and plated through-hole (PTH) assembly techniques. ACI can assist manufacturers that require process development with solder alloy
This PCB design utilizes surface mount technology Product Description This Double Sided Printed Circuit Board is a simple Surface Mount Technology PCB and is used within an Electronic Instrumentation Application Capabilities Applied/Processes Shea
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
Electronics Forum | Thu Feb 19 16:02:49 EST 1998 | Gary Simbulan
I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would appreci
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Continued From Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) 8. PLATING (AND
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Return to Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) PURPOSE AND SCOPE
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, and Wei-Yun Cheng Abstract 17-4 LEAD-FREE SOLDERING FOR SMT COMPONENTS: A REVIEW OF PROCESSING AND RELIABILITY ISSUES Frank Liotine, Jr., PE Abstract 17-4 COMPONENT RELIABILITY ON METAL-BACKED SUBSTRATES FOR HARSH AUTOMOTIVE ENVIRONMENTS John L. Evans
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. The form of reflow soldering process mainly is the profile, referring to the curve of temperature change over time which is tested on SMT component
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