Used SMT Equipment | In-Circuit Testers
Teradyne TS128L System - Configured With: PC (Windows XP and GR Navigate 6.4), MTG (PN 9004-0399), HSC (PN 2277-4711), CST (PN 2277-4712), DS Reference (PN 9004-0265), ICA w/HV (PN 9004-0340) (22) Ultra 128 Pin Cards (PN 9004-0386), (6) Ultra
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
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