Electronics Forum | Wed Jul 04 10:17:18 EDT 2012 | daxman
Good morning, Just a few questions to clarify: 1. You backed up your machine proper data. 2. You upgraded Fuji Flexa. 3. You re-transmitted the proper data 4. Now, components are not placing properly? Do you have a fuji 96-001 calibration board? Ha
Parts & Supplies | SMT Equipment
FUJI VME Board/Circuit Card VME name Part No. Qty. Desc. Remark/Using machine AVME-070 ? 1 /SER-4CH CP43,CP3 AVME-131F ? 1 =131AF,131BF MCS30 PC I/O card AVME-132F ? 1 ? CP642 AVME-132BF ? 1 ? QP242 AVME-300 ? 1 =TVME-300 CP2,CP3 AVME-311F ?
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-BOM-and-Exploded-Views-801-1-05.pdf
. A ll pages dated 09 /20 /96 and 04 /04 /07 (Cover page, Revisions page). Version 2 .2 release. A ll pages dated 02 /03 /92 . Version 2 .1 release. A ll pages dated 08 /30 /91
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
